Chip configuration method, monitoring module and chip

A technology for monitoring modules and chips, which is applied in the computer field and can solve problems such as the time-consuming process of chip configuration

Active Publication Date: 2020-10-23
新华三半导体技术有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] However, as the functions of electronic devices become more and more complex, the number of modules in the chip is increasing, and each module to be con

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  • Chip configuration method, monitoring module and chip
  • Chip configuration method, monitoring module and chip
  • Chip configuration method, monitoring module and chip

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Embodiment Construction

[0045] The following will clearly and completely describe the technical solutions in the embodiments of the present invention with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only some, not all, embodiments of the present invention. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without making creative efforts belong to the protection scope of the present invention.

[0046] Among the configuration time spent on chip configuration, the internal register configuration of the module in the chip usually takes more time. However, there is a great correlation between the configuration parameters of some registers between different modules, and even two registers will be Configure the same configuration parameters. For example, in the development of NP (Network Processor, network processor) chips, SerDes (Serializer / Deserialize...

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Abstract

The embodiment of the invention provides a chip configuration method, a monitoring module and a chip. The monitoring module is additionally arranged in the chip; the monitoring module stores preset associated information used for representing a mapping relationship between register configuration parameters of each target to-be-configured module in the plurality of to-be-configured modules and first configuration parameters issued by the main control module; the main control module issues a first configuration parameter; the monitoring module acquires the first configuration parameter; the second configuration parameters required for configuring each target to-be-configured module can be determined according to the associated information, the respective corresponding second configuration parameters are sent to each target to-be-configured module, and each target to-be-configured module can configure the register in the target to-be-configured module after receiving the respective corresponding second configuration parameters. The master control module does not need to send the configuration parameters to the to-be-configured modules one by one, synchronous configuration of the multiple target to-be-configured modules can be achieved only by issuing the first configuration parameters once, and the time consumed in the chip configuration process is greatly shortened.

Description

technical field [0001] The invention relates to the technical field of computers, in particular to a chip configuration method, a monitoring module and a chip. Background technique [0002] With the wide application of electronic equipment, the performance requirements of electronic equipment are getting higher and higher. The time spent on initial configuration of electronic equipment is an important indicator for evaluating the performance of electronic equipment. The shorter the initial configuration time is, the higher the performance of electronic equipment. The faster the startup speed, this will undoubtedly bring great product competitiveness to the electronic device. [0003] As a core component of an electronic device, a chip is particularly important in the initial configuration process of the electronic device. In the configuration design of common electronic equipment, the chip structure is as follows: figure 1 As shown, the chip includes a main control module ...

Claims

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Application Information

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IPC IPC(8): G06F9/445
CPCG06F9/44505
Inventor 张喆鹏
Owner 新华三半导体技术有限公司
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