A kind of semiconductor test equipment
A test equipment, semiconductor technology, applied in the direction of electronic circuit testing, measuring electricity, measuring devices, etc., can solve the problems of unmanned testing of semiconductor chips, low degree of automation, low efficiency, etc., to improve the service life and equipment volume Small, space-saving effect
Active Publication Date: 2020-12-08
武汉精鸿电子技术有限公司 +1
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Problems solved by technology
[0005] The embodiment of the present application provides a semiconductor testing equipment to solve the problem of low automation, labor-intensive, low efficiency and unmanned testing of semiconductor chips in related technologies relying on manual opening and closing of doors and loading and unloading for aging testing.
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[0052] In order to make the purposes, technical solutions and advantages of the embodiments of the present application clearer, the technical solutions in the embodiments of the present application will be clearly and completely described below in conjunction with the drawings in the embodiments of the present application. Obviously, the described embodiments It is a part of the embodiments of this application, but not all of them. Based on the embodiments in the present application, all other embodiments obtained by persons of ordinary skill in the art without making creative efforts belong to the protection scope of the present application.
[0053] The embodiment of the present application provides a semiconductor testing device, which can solve the problems in the related art that rely on manual door opening and loading and unloading for aging testing, which is low in automation, labor-intensive, and inefficient, and cannot realize unmanned testing of semiconductor chips. ...
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The present application relates to a semiconductor testing equipment, belonging to the technical field of semiconductor testing equipment, comprising: a main body, which includes at least one test box, at least one test cavity is provided in the test box, the top of the test cavity is opened, and the opening is provided with a sealing device for sealing The upper cover of the test chamber, and the test chamber is provided with a horizontally arranged test plate; the upper cover driving assembly, which is connected with the upper cover and used to open or close the upper cover; the loading and unloading device, which is located above the main body, when the upper cover The test board is loaded or unloaded when the upper cover of the drive assembly is opened. The present application does not need to plug and unplug the test board when performing the aging test on the semiconductor chip, which improves the service life of the test board. In addition, the upper cover driving component can automatically open and close the upper cover, and the loading and unloading device can automatically unload and unload materials, which can realize unmanned operation.
Description
technical field [0001] The present application relates to the technical field of semiconductor testing equipment, in particular to a semiconductor testing equipment. Background technique [0002] In order to achieve the qualification rate of semiconductor chips, almost all semiconductor chips are subjected to burn-in tests before leaving the factory. The burn-in test is to provide the necessary system signals for the semiconductor chip to be tested through the test board, simulate the working state of the semiconductor chip, accelerate the electrical failure of the semiconductor chip under high temperature or other conditions, and obtain the failure rate of the semiconductor chip within a period of time. The semiconductor chip works under a given load state to make its defects appear in a short period of time, so as to obtain the approximate failure rate of the semiconductor chip in its life cycle, and avoid failure in the early stage of use. [0003] In related technologie...
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IPC IPC(8): G01R31/28
CPCG01R31/2862G01R31/2874
Inventor 曹锐杜建裴敬邓标华
Owner 武汉精鸿电子技术有限公司