SIP laminated structure

Abstract

The invention discloses an SIP laminated structure, which comprises a tube shell, a bonding lead column, a power substrate, a functional substrate and at least three functional lead columns. The bonding lead column and the power substrate are fixed on the bottom wall of the tube shell, and the power substrate is in bonding connection with the bonding lead column. The functional lead columns vertically penetrate through and are fixedly connected with the bottom wall of the tube shell. Each functional lead column comprises an inner lead column positioned in the tube shell and an outer lead column positioned outside the tube shell. The functional substrate is fixedly connected with the inner lead columns of the at least two functional lead columns and is electrically connected with the powersubstrate or the inner lead column of the at least one functional lead column. The functional substrate of the SIP laminated structure can be fixedly connected through any two or more functional leadcolumns in the at least three functional lead columns, flexible laminated design is achieved, and the assembly density is easy to improve. The functional lead column has an electric connection function, the number of internal connecting wires can be reduced, space waste is reduced, and the product size can be reduced.

Description

technical field [0001] The invention relates to the technical field of SIP, in particular to a SIP laminated structure. Background technique [0002] Generally, solid-state relays, solid-state power controllers, power modules or hybrid integrated circuits adopt single-layer or double-layer structures, and some products adopt more than The stacked design is carried out in the form of steps. These traditional methods are often bulky and have single functions, which are difficult to meet the current high sealing and miniaturization assembly requirements. At the same time, as the output of this control device, it is often prone to device breakdown caused by external factors such as system overvoltage and electrostatic discharge. Therefore, redundant design and protection design are required in use, and the application is more complicated. Contents of the invention [0003] The purpose of the present invention is to propose a SIP laminated structure, which has the advantages o...

AI Technical Summary

Problems solved by technology

[0002]Usually solid state relays, solid state power controllers, power modules or hybrid integrated circuits adopt single-layer or double-layer structures, and some products adopt more than two-layer structures, but It is often designed in a layer-by-layer method, or stacked by adding steps. These traditional methods are often bulky and have a single function, which is difficult to meet the current high-seal and miniaturization assembly requirements.

At the same time, as the output of this kind of control device, it is often prone to device breakdown caused by external factors such as system overvoltage and electrostatic discharge. Therefore, redundant design and protection design are required in use, and the application is more complicated.

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