Conductive sponge as well as preparation method and application thereof

A conductive sponge and copolymer technology, applied in the field of pressure-sensitive adhesives, can solve the problems of large thickness, poor adhesion of pressure-sensitive adhesives, and stripping, etc., and achieve the effects of facilitating conductive paths, increasing speed, and improving conductivity.

Active Publication Date: 2020-11-03
东莞华誉精密技术有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] The foam matrix itself occupies a relatively large thickness, generally above 150 μm, and it is also prone to the problem of poor bonding with the pressure-sensitive adhesive, so that it is prone to material stripping during the automatic retrieving process.

Method used

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  • Conductive sponge as well as preparation method and application thereof
  • Conductive sponge as well as preparation method and application thereof
  • Conductive sponge as well as preparation method and application thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0026] A conductive sponge, comprising the following raw materials in parts by weight:

[0027]

[0028] Described acrylate copolymer is made by following raw material:

[0029]

[0030] Wherein, the active monomer is composed of isooctyl acrylate, glycidyl methacrylate and butyl acrylate in a weight ratio of 15:25:60.

[0031] Wherein, the tackifying resin is terpene-phenolic resin.

[0032] Wherein, the blowing agent is sodium bicarbonate.

[0033] Wherein, the photoinitiator is composed of 907 photoinitiator, 1173 photoinitiator and TPO photoinitiator in a weight ratio of 1:1:1.

[0034] Wherein, the second thermal initiator is BPO; the first thermal initiator is composed of BPO and LPO in a weight ratio of 3:1.

[0035] Wherein, the particle diameter of the nano conductive carbon black is 25nm.

[0036] Wherein, the preparation method of described acrylate copolymer is: the butyl acrylate of 10 weight parts, the methyl acrylate of 4 weight parts, the nanometer co...

Embodiment 2

[0039] The difference between this embodiment and embodiment 1 is:

[0040] The first thermal initiator is composed of BPO and LPO in a ratio of 1:1 by weight.

Embodiment 3

[0042] The difference between this embodiment and embodiment 1 is:

[0043] The first thermal initiator is BPO.

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Abstract

The invention relates to the technical field of pressure-sensitive adhesives, in particular to conductive sponge as well as a preparation method and application thereof. The conductive sponge is prepared from the following raw materials: an acrylate copolymer, an active monomer, tackifying resin, a foaming agent, a photoinitiator and a first thermal initiator; the pressure-sensitive adhesive disclosed by the invention is a photo-thermal curing pressure-sensitive adhesive; due to the photo-curing effect, the areas that are more liable to be irradiated are more liable to react, whereas the non-irradiated shadow area does not react, so that the surface of the pressure-sensitive adhesive is cured in advance by utilizing the photo-curing characteristic and controlling the curing condition, andheat curing is carried out after the pressure-sensitive adhesive has certain hardness; in addition, foaming is carried out while thermocuring is carried out, so that bubbles are formed in the pressure-sensitive adhesive, the pressure-sensitive adhesive with a sponge structure inside and a complete bonding surface on the surface is prepared; the pressure-sensitive adhesive has the functions of electric conduction, elasticity and viscosity.

Description

technical field [0001] The invention relates to the technical field of pressure-sensitive adhesives, in particular to a conductive sponge and its preparation method and application. Background technique [0002] Foam tape is made of EVA or PE foam as the base material, coated with solvent-based (or hot-melt) pressure-sensitive adhesive on one or both sides, and then coated with release paper. It has the functions of sealing and shock absorption. It has excellent sealing performance, compression deformation resistance, flame retardancy, wettability, etc. Products are widely used in electronic and electrical products, mechanical parts, various small household appliances, mobile phone accessories, industrial instruments, computers and peripheral equipment, auto parts, audio-visual equipment, toys, cosmetics, etc. [0003] The foam matrix itself occupies a relatively large thickness, generally above 150 μm, and it is also prone to the problem of poor bonding with the pressure-...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C09J133/08C09J11/08C09J9/02C09J7/10C09J7/38C08J9/08C08F220/18C08F220/14C08F220/06C08F220/32C08F265/06
CPCC09J133/068C09J11/08C09J9/02C09J7/10C09J7/385C08J9/08C08F220/1804C08F265/06C08J2203/02C08K2201/011C08K2201/001C08L33/064C08L61/14C08K3/04C08F220/14C08F220/06C08F220/1808C08F220/325
Inventor 袁平朱宗玉谢涛丁杰梅志亮陈秀忠
Owner 东莞华誉精密技术有限公司
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