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A kind of conductive sponge and its preparation method and application

A technology of conductive sponge and thermal initiator, applied in the field of pressure-sensitive adhesives, can solve the problems of stripping, large thickness, poor adhesion of pressure-sensitive adhesives, etc., and achieve the effect of improving electrical conductivity

Active Publication Date: 2022-04-05
东莞华誉精密技术有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] The foam matrix itself occupies a relatively large thickness, generally above 150 μm, and it is also prone to the problem of poor bonding with the pressure-sensitive adhesive, so that it is prone to material stripping during the automatic retrieving process.

Method used

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  • A kind of conductive sponge and its preparation method and application
  • A kind of conductive sponge and its preparation method and application
  • A kind of conductive sponge and its preparation method and application

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0026] A conductive sponge, comprising the following raw materials in parts by weight:

[0027]

[0028] Described acrylate copolymer is made by following raw material:

[0029]

[0030] Wherein, the active monomer is composed of isooctyl acrylate, glycidyl methacrylate and butyl acrylate in a weight ratio of 15:25:60.

[0031] Wherein, the tackifying resin is terpene-phenolic resin.

[0032] Wherein, the blowing agent is sodium bicarbonate.

[0033] Wherein, the photoinitiator is composed of 907 photoinitiator, 1173 photoinitiator and TPO photoinitiator in a weight ratio of 1:1:1.

[0034] Wherein, the second thermal initiator is BPO; the first thermal initiator is composed of BPO and LPO in a weight ratio of 3:1.

[0035] Wherein, the particle diameter of the nano conductive carbon black is 25nm.

[0036] Wherein, the preparation method of described acrylate copolymer is: the butyl acrylate of 10 weight parts, the methyl acrylate of 4 weight parts, the nanometer co...

Embodiment 2

[0039] The difference between this embodiment and embodiment 1 is:

[0040] The first thermal initiator is composed of BPO and LPO in a ratio of 1:1 by weight.

Embodiment 3

[0042] The difference between this embodiment and embodiment 1 is:

[0043] The first thermal initiator is BPO.

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Abstract

The invention relates to the technical field of pressure-sensitive adhesives, in particular to a conductive sponge and its preparation method and application. The conductive sponge includes the following raw materials: acrylate copolymer, active monomer, tackifying resin, foaming agent, photoinitiator and the first A thermal initiator; the pressure-sensitive adhesive of the present invention is a light-heat-curable pressure-sensitive adhesive. The characteristic of light-curing is that the area that is more likely to be irradiated is more likely to react, and the shadow area that is not irradiated does not react. Therefore, the characteristic of light-curing is used And by controlling the curing conditions, the surface of the pressure-sensitive adhesive is cured first, and then heat-cured after it has a certain hardness. Foaming is carried out while heat-curing, so that bubbles are formed inside the pressure-sensitive adhesive, thereby obtaining a sponge structure inside and a surface. A pressure-sensitive adhesive with an integral bonding surface that combines conductive, elastic and tacky functions.

Description

technical field [0001] The invention relates to the technical field of pressure-sensitive adhesives, in particular to a conductive sponge and its preparation method and application. Background technique [0002] Foam tape is made of EVA or PE foam as the base material, coated with solvent-based (or hot-melt) pressure-sensitive adhesive on one or both sides, and then coated with release paper. It has the functions of sealing and shock absorption. It has excellent sealing performance, compression deformation resistance, flame retardancy, wettability, etc. Products are widely used in electronic and electrical products, mechanical parts, various small household appliances, mobile phone accessories, industrial instruments, computers and peripheral equipment, auto parts, audio-visual equipment, toys, cosmetics, etc. [0003] The foam matrix itself occupies a relatively large thickness, generally above 150 μm, and it is also prone to the problem of poor bonding with the pressure-...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C09J133/08C09J11/08C09J9/02C09J7/10C09J7/38C08J9/08C08F220/18C08F220/14C08F220/06C08F220/32C08F265/06
CPCC09J133/068C09J11/08C09J9/02C09J7/10C09J7/385C08J9/08C08F220/1804C08F265/06C08J2203/02C08K2201/011C08K2201/001C08L33/064C08L61/14C08K3/04C08F220/14C08F220/06C08F220/1808C08F220/325
Inventor 袁平朱宗玉谢涛丁杰梅志亮陈秀忠
Owner 东莞华誉精密技术有限公司
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