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Chuck device in wafer cleaning equipment and wafer cleaning equipment

A technology for cleaning equipment and chucks, applied in electrical components, semiconductor/solid-state device manufacturing, circuits, etc., can solve problems such as poor versatility of chuck devices, and achieve the effect of increasing usage scenarios and improving product competitiveness.

Pending Publication Date: 2020-11-03
BEIJING NAURA MICROELECTRONICS EQUIP CO LTD
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  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] The present application discloses a chuck device in wafer cleaning equipment and wafer cleaning equipment, which can solve the problem of poor versatility of the chuck device

Method used

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  • Chuck device in wafer cleaning equipment and wafer cleaning equipment
  • Chuck device in wafer cleaning equipment and wafer cleaning equipment
  • Chuck device in wafer cleaning equipment and wafer cleaning equipment

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Embodiment Construction

[0019] In order to make the purpose, technical solution and advantages of the present application clearer, the technical solution of the present application will be clearly and completely described below in conjunction with specific embodiments of the present application and corresponding drawings. Apparently, the described embodiments are only some of the embodiments of this application, not all of them. Based on the embodiments in this application, all other embodiments obtained by persons of ordinary skill in the art without making creative efforts belong to the scope of protection of this application.

[0020] The terms "first", "second" and the like in the specification and claims of the present application are used to distinguish similar objects, and are not used to describe a specific sequence or sequence. It is to be understood that the data so used are interchangeable under appropriate circumstances such that the embodiments of the application can be practiced in sequ...

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Abstract

The invention discloses a chuck device in wafer cleaning equipment and wafer cleaning equipment. The chuck device is characterized in that a plurality of clamping parts form a clamping space, a to-be-clamped part can be clamped in the clamping space, and the plurality of clamping parts are in drive connection with a transmission part; an elastic part is connected with the transmission part, the elastic part can drive the transmission part to rotate, and the transmission part can drive the multiple clamping parts to clamp the to-be-clamped part under the condition that the transmission part rotates in the first rotating direction; a driving mechanism can drive the chuck device to be switched between a first clamping state and a second clamping state, and when the chuck device is in the first clamping state, the elastic part drives the transmission part to rotate in the first rotating direction through first driving force. Under the condition that the chuck device is in the second clamping state, the elastic part drives the transmission part to rotate in the first rotating direction through second driving force, wherein the second driving force is greater than the first driving force. According to the scheme, the problem that a chuck device is poor in universality can be solved.

Description

technical field [0001] The present application relates to the technical field of semiconductor manufacturing, and in particular to a chuck device and wafer cleaning equipment in wafer cleaning equipment. Background technique [0002] In the process of semiconductor processing, the cleanliness of the wafer surface is one of the important factors affecting the reliability of semiconductor devices. In the process of wafer processing, deposition, plasma etching, spin-coating photoresist, photolithography and Processing methods such as electroplating may lead to the introduction of pollutants on the wafer surface, resulting in a decrease in the cleanliness of the wafer surface, resulting in a low yield of semiconductor devices manufactured using the wafer. Therefore, it is necessary to use cleaning equipment to clean the wafer after processing. Wafers are cleaned. [0003] When cleaning the wafer, it is usually necessary to fix the wafer on the chuck device of the cleaning equip...

Claims

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Application Information

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IPC IPC(8): H01L21/687H01L21/67
CPCH01L21/68721H01L21/68785H01L21/6704
Inventor 许璐赵宏宇王锐廷徐剑楠
Owner BEIJING NAURA MICROELECTRONICS EQUIP CO LTD
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