Chuck device in wafer cleaning equipment and wafer cleaning equipment
A technology for cleaning equipment and chucks, applied in electrical components, semiconductor/solid-state device manufacturing, circuits, etc., can solve problems such as poor versatility of chuck devices, and achieve the effect of increasing usage scenarios and improving product competitiveness.
- Summary
- Abstract
- Description
- Claims
- Application Information
AI Technical Summary
Problems solved by technology
Method used
Image
Examples
Example Embodiment
[0019] In order to make the objects, technical solutions and advantages of the present application, the technical solutions of the present application will be described in conjunction with the specific embodiments and corresponding drawings of the present application. Obviously, the described embodiments are merely part of embodiments of the present disclosure, rather than all embodiments. Based on the embodiments in the present application, one of ordinary skill in the art is in the scope of the present application without making creative labor premistence.
[0020] The term "first", "second", "second", or the like in the specification of the present application and the like are used to distinguish a similar object, and is not intended to describe a particular order or ahead order. It is to be understood that the data such as use can be interchanged in appropriate, so that the embodiments of the present application can be implemented in the order other than those illustrated or d...
PUM
Abstract
Description
Claims
Application Information
- R&D Engineer
- R&D Manager
- IP Professional
- Industry Leading Data Capabilities
- Powerful AI technology
- Patent DNA Extraction
Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic.
© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap