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Preparation method of array substrate

A technology of array substrates and substrate substrates, which is applied in semiconductor/solid-state device manufacturing, electrical components, diodes, etc., can solve problems such as abnormal channel characteristics of the active layer, and achieve the effect of simplifying the etching process

Pending Publication Date: 2020-11-03
BLACK COW FOOD
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  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0007] The object of the present invention is to provide an array substrate and its preparation method, which can overcome the problem of abnormal channel characteristics of the active layer caused by the interruption of the active layer in the opening area in the S direction of the existing array substrate

Method used

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Embodiment Construction

[0032] In order to have a further understanding of the purpose, structure, features, and functions of the present invention, the following detailed descriptions are provided in conjunction with the embodiments.

[0033] In the description of the present invention, it should be noted that the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer" etc. The indicated orientation or positional relationship is based on the orientation or positional relationship shown in the drawings, and is only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the referred device or element must have a specific orientation, or in a specific orientation. construction and operation, therefore, should not be construed as limiting the invention.

[0034] Such as figure 2 , image 3 as well as Figure 4A to Figure 4H As shown, the present invention provides a method for preparing an...

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Abstract

The invention discloses a preparation method of an array substrate. The preparation method comprises the following steps: S1, providing a substrate; S2, forming an active layer on the surface of one side of the substrate; S3, forming a functional film layer on the surface of one side, far away from the substrate, of the active layer; S4, after the above steps, forming a groove in the open pore region through an etching process, wherein the groove penetrates through the functional film layer and the active layer from top to bottom, and the groove is located in the open pore region. According tothe preparation method of the array substrate, the functional layers are prepared on the surface of the side, away from the substrate body, of the active layer, then the functional layers and the active layer are etched through the etching process to form the groove, the groove is located in the open hole area of the array substrate, and the defects that when an existing array substrate is prepared, due to a fact that the active layer is etched firstly, and then each functional layer is prepared, the channel characteristics of the active layers on the two sides of the open pore region are abnormal.

Description

technical field [0001] The invention relates to the field of display technology, in particular to a method for preparing an array substrate. Background technique [0002] The full screen design has become the mainstream design in the mobile terminal (smart phone) market. At present, in order to further increase the screen-to-body ratio of the front of the mobile phone and realize the "true full-screen" display, the camera technology under the screen has received widespread attention. [0003] The under-display camera technology is mainly to etch the position corresponding to the camera on the display panel through the etching process, etch out the receiving hole, and then place the camera module in the receiving hole. [0004] In the existing etching process for forming accommodating holes, an active layer 2 is formed on the surface of one side of the substrate 1, and a groove 3 is pre-formed on the active layer 2 corresponding to the position of the camera accommodating ho...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L21/77H01L27/12H01L27/32
CPCH01L27/1259H01L27/127H01L27/1214H10K59/65H10K59/12
Inventor 刘甲定吴南辉杨永光苏文学齐之刚
Owner BLACK COW FOOD
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