Manufacturing system and manufacturing method of printed circuit board based on co2 laser

Abstract

The present invention provides a CO2 laser-based printed circuit board production system and production method. The production includes: providing a substrate prepared with a number of metal circuits, using CO2 laser to etch the area to be slotted to form a cavity, and drilling through CO2 laser, The first round of etching is performed along the cavity contour to form n first etching holes, and the mth round of etching is continued to form n mth etching holes, and adjacent rounds are stepped by a preset distance. The invention adopts the CO2 laser to improve the production capacity and work efficiency, and reduces the cost. The smaller etching hole spacing is realized to ensure the smoothness of the cutting surface, and sufficient cooling time is left to help prevent the product from burning, carbonization, and blackening during the cutting process. The secondary protective sacrificial film layer prevents the gray stains generated during laser processing from contaminating other parts of the product, and disperses the thermal effect on the product surface during laser processing to make the laser-cut surface neat and smooth. The method of introducing a rotating substrate during the green oil coating process can effectively ensure the uniformity of the green oil in the tank.

Description

technical field [0001] The invention belongs to the field of printed circuit board production, in particular to a CO2 laser-based printed circuit board production system and production method. Background technique [0002] With the rapid development of technology in the electronics industry, some PCB (printed circuit board) products require cavity operation, but the traditional slotting method is carried out by UV laser milling machine, because the UV laser spot is small, it is not easy Carbonization occurs, but the main disadvantages of UV laser milling machines are: low production capacity and high cost. If the CO2 laser drilling machine can be used, the production capacity will be greatly improved, the work efficiency will be improved, and the cost will be effectively reduced. However, the CO2 laser has a large spot and a long wavelength. The main mechanism of action is: the thermal effect generated during laser ablation is used to decompose and gasify the material. This...

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Problems solved by technology

[0004] In view of the above-mentioned shortcomings of the prior art, the object of the present invention is to provide a CO2 laser-based printed circuit board production system and production method, which is used to solve the problem of CO2 laser etching in the prior art, which is difficult to obtain smooth and high-quality cutting On the other hand, it is difficult to prepare high-quality cavities and other problems

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