LED packaging structure with uniform light source heat distribution
A technology of LED packaging and heat distribution, which is applied in the direction of light sources, semiconductor devices of light-emitting elements, cooling/heating devices of lighting devices, etc., and can solve problems affecting the light-emitting chips and melting
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[0024] The following will clearly and completely describe the technical solutions in the embodiments of the present invention with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only some, not all, embodiments of the present invention. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without making creative efforts belong to the protection scope of the present invention.
[0025] see Figure 1-5, the present invention provides a technical solution: an LED packaging structure with uniform light source heat distribution, including a base 1, the base 1 is a circular base structure, and the upper end of the base 1 is provided with a placement groove 2, Placement groove 2 is circular groove shape, and the interior of described placement groove 2 is provided with light-emitting chip 3, and light-emitting chip 3 is existing structure, ...
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Abstract
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