LED packaging structure with uniform light source heat distribution

A technology of LED packaging and heat distribution, which is applied in the direction of light sources, semiconductor devices of light-emitting elements, cooling/heating devices of lighting devices, etc., and can solve problems affecting the light-emitting chips and melting

Inactive Publication Date: 2020-11-17
深圳市明锐信息科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Existing LED lamp beads are limited by their own materials, and their luminescence is particularly affected by temperature. When the light-emitting chip is more illuminated, the temperature of the chip itself is higher. At this time, the fluorescent glue filled on the chip is affected by high temperature. The phenomenon of melting may occur under the environment, thus affecting the illuminance of the light-emitting chip. Therefore, we propose a LED packaging structure with uniform heat distribution of the light source.

Method used

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  • LED packaging structure with uniform light source heat distribution
  • LED packaging structure with uniform light source heat distribution
  • LED packaging structure with uniform light source heat distribution

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Embodiment Construction

[0024] The following will clearly and completely describe the technical solutions in the embodiments of the present invention with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only some, not all, embodiments of the present invention. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without making creative efforts belong to the protection scope of the present invention.

[0025] see Figure 1-5, the present invention provides a technical solution: an LED packaging structure with uniform light source heat distribution, including a base 1, the base 1 is a circular base structure, and the upper end of the base 1 is provided with a placement groove 2, Placement groove 2 is circular groove shape, and the interior of described placement groove 2 is provided with light-emitting chip 3, and light-emitting chip 3 is existing structure, ...

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Abstract

The invention discloses an LED packaging structure with uniform light source heat distribution, and relates to the technical field of LED packaging, the LED packaging structure with uniform light source heat distribution comprises a base and a circular base structure of the base, a placement groove is formed in the upper end of the base, the placement groove is in a circular groove shape, and a light-emitting chip is arranged in the placement groove. According to the LED packaging structure, when an external power supply is used for emitting light, the light-emitting chip can drive the micro motor to be started through the power line, the rotating shaft is movably connected with the driving shaft in a clamped mode, the fan blades installed on the two outer wall faces can rotate along withthe rotating shaft, and when the light-emitting chip is started to emit light, the fluorescent latex can fill the light-emitting chip and the interior of the containing groove; when the light-emittingchip continuously illuminates, the fluorescent latex melts at the high temperature of the light-emitting chip, and the two driving shafts drive the fan blades to rotate to blow the fluorescent latex,so that the temperature of the fluorescent latex can be reduced, the influence on the illumination of the light-emitting chip is avoided, and the effect of improving the illumination of the light-emitting chip is achieved.

Description

technical field [0001] The invention relates to the technical field of LED packaging, in particular to an LED packaging structure with uniform heat distribution of a light source. Background technique [0002] The full name of the LED is a semiconductor light-emitting diode. It is made of semiconductor materials and is a light-emitting device that directly converts electrical energy into light energy and electrical signals into optical signals. It is characterized by low power consumption, high brightness, bright colors, anti-vibration, long life, cold light source, etc. It is a real "green lighting" and is widely used in lighting, LED large-screen display, traffic lights, decoration, computers, Electronic toys, gifts, switches, telephones, advertisements, city glory projects and many other production fields. Existing LED lamp beads are limited by their own materials, and their luminescence is particularly affected by temperature. When the light-emitting chip has stronger i...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): F21K9/20F21K9/64F21K9/69F21V29/503F21V29/67F21V29/71F21V15/04F21V33/00F21Y115/10
CPCF21K9/20F21K9/64F21K9/69F21V29/503F21V29/67F21V29/71F21V15/04F21V33/00F21Y2115/10
Inventor 陈业凤陶静
Owner 深圳市明锐信息科技有限公司
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