Integrated circuit processing chip mounting device
A technology of patch device and integrated circuit, which is applied in the directions of printed circuit, printed circuit manufacturing, assembling printed circuit with electrical components, etc., can solve the problems of difficult maintenance, rough structure, high production cost, etc. Pulling and breaking, perfect winding and messy effect
Active Publication Date: 2020-11-17
惠州市合创电子科技有限公司
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Problems solved by technology
[0008] The purpose of the present invention is to provide an integrated circuit processing and patching device to solve the problem of rough structure, single function or too precise device, high production cost, difficult maintenance, and only one piece of production proposed in the above background technology. , Low production efficiency, rough metal connection structure and stress mode, which cause unnecessary damage and other problems
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[0030] The following will clearly and completely describe the technical solutions in the embodiments of the present invention with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only some, not all, embodiments of the present invention. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without making creative efforts belong to the protection scope of the present invention.
[0031] see Figure 1-6 , the present invention provides a technical solution: an integrated circuit processing patch device, including an operating table 1, four corners at the bottom of the operating table 1 are respectively fixedly connected with supporting feet 2, and the supporting feet 2 are fixedly connected horizontally with The first shelf 3 and the four corners at the top of the console 1 are respectively fixedly connected with frame posts 13, and the...
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The invention discloses an integrated circuit processing chip mounting device which comprises an operation table, supporting legs are fixedly connected to the four corners of the bottom end of the operation table respectively, a first storage rack is transversely and fixedly connected between the supporting legs, and frame columns are fixedly connected to the four corners of the top end of the operation table respectively. And an opening top plate is transversely and fixedly connected between the frame columns, and one side of the bottom end of the opening top plate is fixedly connected with adispensing mechanism. According to the integrated circuit processing chip mounting device, when an integrated circuit board is conveyed to the position below the air outlet after chip mounting is completed, the fan can blow cold air generated by the condenser to the integrated circuit board where chip mounting is completed through the air outlet, solidification of glue is accelerated, and it is avoided that in the subsequent processing process, due to the fact that connection of a chip is possibly not firm, and the chip is subjected to collision and so on, the chip is offset. And after condensation is completed, treatment of the device is completed, and the chips are conveyed to the next machining mechanism.
Description
technical field [0001] The invention relates to the technical field of integrated circuit processing, in particular to an integrated circuit processing and patching device. Background technique [0002] In the environment of rapid development of science and technology, electrical appliances have played an irreplaceable role in people's daily life, whether it is a large home appliance or a mobile phone remote control, and these electrical appliances have one thing in common It is the main part of the integrated circuit that is needed. Under the innovative development of industrial technology, the processing and placement of integrated circuits also need to be innovated. [0003] In the process of realizing the present invention, the inventors have found that at least the following problems in the prior art have not been resolved: [0004] (1) Traditional integrated circuit processing and placement devices are at two extremes, one is rough in structure, has a single function,...
Claims
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Login to View More IPC IPC(8): H05K13/04H05K3/30
CPCH05K3/305H05K13/043H05K13/0469
Inventor 陈圆圆
Owner 惠州市合创电子科技有限公司