An integrated circuit processing and placement device

Abstract

The invention discloses an integrated circuit processing patch device, which includes an operating table, four corners at the bottom of the operating table are respectively fixedly connected with supporting feet, and a first storage rack is fixedly connected horizontally between the supporting feet, and the The four corners of the top of the console are respectively fixedly connected with frame posts, and an open top plate is fixedly connected horizontally between the frame posts, and one side of the bottom end of the open top plate is fixedly connected with a dispensing mechanism. The integrated circuit processing and placement device, when the integrated circuit board is placed and sent to the bottom of the air outlet, the fan will blow the cold air generated by the condenser to the completed integrated circuit board through the air outlet to accelerate the solidification of the colloid. It avoids the trouble that the chip may be shifted due to impact and other factors during the next processing process due to the weak connection. After the condensation is completed, the device is processed and sent to the next processing mechanism.

Description

technical field [0001] The invention relates to the technical field of integrated circuit processing, in particular to an integrated circuit processing and patching device. Background technique [0002] In the environment of rapid development of science and technology, electrical appliances have played an irreplaceable role in people's daily life, whether it is a large home appliance or a mobile phone remote control, and these electrical appliances have one thing in common It is the main part of the integrated circuit that is needed. Under the innovative development of industrial technology, the processing and placement of integrated circuits also need to be innovated. [0003] In the process of realizing the present invention, the inventors have found that at least the following problems in the prior art have not been resolved: [0004] (1) Traditional integrated circuit processing and placement devices are at two extremes, one is rough in structure, has a single function,...

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Problems solved by technology

[0008] The purpose of the present invention is to provide an integrated circuit processing and patching device to solve the problem of rough structure, single function or too precise device, high production cost, difficult maintenance, and only one piece of production proposed in the above background technology. , Low production efficiency, rough metal connection structure and stress mode, which cause unnecessary damage and other problems

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