A polishing device and chemical mechanical planarization equipment
A polishing device and polishing pad technology, used in grinding/polishing equipment, grinding devices, metal processing equipment, etc., can solve problems such as poor wafer surface uniformity, improve yield, ensure smoothness, and improve polishing efficiency Effect
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Embodiment 1
[0033] like Figure 1 to Figure 4 As shown, the present invention provides a polishing device, comprising a main body 3 and a protective cover 4 disposed outside the main body 3, an infusion assembly is located in the main body 3 and / or the protective cover 4, and the infusion assembly has at least one The liquid outlet 6 , the liquid ejected from the liquid outlet 6 is evenly distributed on the contact area of the polishing pad 1 .
[0034] The infusion assembly is communicated with an external liquid storage container (not shown in the figure) through a pipeline to deliver liquid for the infusion assembly, and the liquid is polishing liquid. By arranging the liquid infusion component inside the polishing device, the liquid can move with the movement of the polishing device. When the liquid is sprayed on the contact area between the wafer 2 and the polishing pad 1, the liquid can evenly contact the wafer 2 , so that the chemical reaction between the wafer 2 and the liquid ...
Embodiment 2
[0040] like figure 2 As shown, the infusion assembly can also be arranged in the main body 3, wherein the main body 3 includes a main shaft 31, a rotating assembly 32 sleeved on the main shaft 31, and a retaining ring 33 disposed at the bottom of the rotating assembly 32 to protect the The cover 4 is sleeved on the outside of the rotating assembly 32 and the retaining ring 33, and the infusion channel 5 runs through the rotating assembly 32 and the retaining ring 33, so as to spray the liquid evenly on the contact area.
[0041]Specifically, at least one of the liquid outlets 6 is provided in multiples at the bottom of the retaining ring 33 and spaced along the axial direction of the retaining ring 33 . The liquid outlet 6 may be uniformly disposed on the holding ring 33 , and of course, may also be non-uniformly disposed on the holding ring 33 .
[0042] like image 3 As shown, specifically, the projections of the plurality of liquid outlets 6 on the retaining ring 33 are ...
Embodiment 3
[0045] The infusion assembly can also be arranged in the main body 3 and the protective cover 4 together, so as to ensure the output of the liquid. When the infusion assembly in the main body 3 is blocked, the liquid can also be ejected through the infusion assembly in the protective cover 4; When the infusion set in the protective cover 4 is blocked, the liquid can also be ejected through the infusion set in the main body 3 .
[0046] The present invention also provides a chemical mechanical planarization device, including the polishing device.
[0047] The specific working process: use the polishing device to absorb the wafer 2, place the wafer 2 on the polishing pad 1, apply a certain pressure to the wafer 2, and start polishing. The liquid port 6 sprays the liquid in the liquid container evenly on the contact area of the polishing pad 1 through the infusion channel 5 and the liquid outlet 6, thereby ensuring the uniformity of the liquid distribution on the polishing pad ...
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