Round silicon wafer grinding disc with accurate positioning function

Abstract

The invention discloses a round silicon wafer grinding disc with an accurate positioning function. The round silicon wafer grinding disc comprises a grinding base disc, an annular water collecting groove is formed in an outer ring of the upper end face of the grinding base disc, a water retaining ring is formed in the position, on the outer side of the water collecting groove, of the grinding basedisc, a gear shaft is arranged in the center of the grinding base disc, a guide shaft is formed at the upper end of the gear shaft, a transmission shaft is formed at the lower end of the gear shaft,the transmission shaft is hinged to the grinding base disc through a bearing, a plurality of positioning discs are arranged at the positions, on the periphery of the gear shaft, of the grinding base disc, the positioning discs are annularly and uniformly distributed around the central axis of the gear shaft, gear rings are formed on outer rings of the positioning discs, the gear rings are meshed with the gear shaft, positioning columns are inserted into the centers of the positioning discs, the lower ends of the positioning columns are inserted and fixed on the grinding base disc, positioningholes are formed in the positions, on the peripheries of the positioning columns, of the positioning discs, positioning grooves are formed in the positions, among the positioning holes, of the positioning discs, and the positioning grooves or the positioning holes are annularly and uniformly distributed around the central axes of the positioning columns.

Description

technical field [0001] The invention relates to the technical field of semiconductor grinding machines, in particular to a circular silicon wafer grinding disc which is convenient for precise positioning. Background technique [0002] At present, in the preparation process of semiconductor raw material silicon wafers, it is necessary to use a grinder to grind the surface of the cut circular silicon wafers. The existing grinder is generally equipped with a lower grinding disc and an upper grinding disc. It rotates in the opposite direction to the lower grinding table, and then grinds the silicon wafer placed on the lower grinding table. In order to prevent the irregular movement of the silicon wafer, a positioning plate that can position the silicon wafer will be set on the lower grinding table. At the same time, in order to improve the grinding effect, it will The ring gear is formed on the outside of the positioning plate, and the center gear is used to drive the positionin...

AI Technical Summary

Problems solved by technology

[0002] At present, in the preparation process of semiconductor raw material silicon wafers, it is necessary to use a grinder to grind the surface of the cut circular silicon wafers. The existing grinder is generally equipped with a lower grinding disc and an upper grinding disc. Rotate in the opposite direction to the lower grinding table, and then grind the silicon wafer placed on the lower grinding table. In order to prevent the irregular movement of the silicon wafer, a positioning plate that can position the silicon wafer will be set on the lower grinding table. At the same time, in order to improve the grinding effect, it will The ring gear is formed on the outside of the positioning plate, and the center gear is used to drive the positioning plate to rotate, so that the silicon wafers can also rotate regularly. However, at present, the silicon wafers are placed on the positioning plate manually, and the efficiency of manual placement is low; For the placement of the manipulator, the use of the manipulator requires the precise positioning of the positioning hole for placing the silicon wafer on the positioning plate, and the positioning of the positioning plate needs to be precisely adjusted during the installation process to meet the requirements of the use of the manipulator, and then the positioning plate The installation is more troublesome

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