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Water mist vaporization rapid cooling device for SMC part

A rapid cooling and cooling device technology, which is applied in the field of cooling devices for SMC molded parts, can solve the problems of production efficiency decline, cost increase, and long cooling process, and achieve the effect of increasing the blowing range and improving cooling efficiency

Active Publication Date: 2020-11-20
杉盛鸿泰复合材料(武汉)有限公司
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  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] Because the cooling process is relatively long, especially in summer, the entire cooling time even reaches 6 minutes, while the molding cycle of general SMC parts is within 5 minutes. The mismatch between the cooling cycle and the molding cycle results in a decrease in production efficiency and an increase in cost.

Method used

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  • Water mist vaporization rapid cooling device for SMC part
  • Water mist vaporization rapid cooling device for SMC part
  • Water mist vaporization rapid cooling device for SMC part

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Embodiment Construction

[0037] In order to facilitate the understanding of the present invention, the present invention will be described more fully below with reference to the relevant drawings, in which several embodiments of the present invention are shown, but the present invention can be realized in different forms, and is not limited to the text described On the contrary, these embodiments are provided to make the disclosure of the present invention more thorough and comprehensive.

[0038] It should be noted that when an element is said to be "fixed on" another element, it can be directly on the other element or there can be an intervening element, and when an element is said to be "connected" to another element, it can be Directly connected to another element or possibly intervening elements at the same time, the terms "vertical," "horizontal," "left," "right," and similar expressions are used herein for purposes of illustration only.

[0039] Unless otherwise defined, all technical and scien...

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Abstract

The invention provides a water mist vaporization rapid cooling device for an SMC part. The water mist vaporization rapid cooling device comprises a cooling device body and an SMC part body. The cooling device body comprises a tool platform frame, the tool platform frame is composed of a table top and a supporting frame at the bottom of the table top. The SMC part body is arranged at the upper endof the table top, and a cooling module is arranged at the lower end of the table top. The cooling module comprises fan bases, a fan swing mechanism and cooling fans. The fan swing mechanism is arranged between the bottoms of the two fan bases and performs swing motion, a humidifier is arranged on one side of the tool platform frame, and a water mist release device is arranged at the lower end of the table top and comprises a water inlet pipe and an H-shaped water mist release pipe. A plurality of mist spraying holes are formed in pipe bodies on the two sides of the H-shaped water mist releasepipe respectively, and the mist spraying direction of the mist spraying hole point to the positions above air outlets of the two cooling fans. The cooling area is increased through a cooling mode of mixing water mist and air flow and swinging of the two cooling fans, and the cooling efficiency of the SMC part body is well improved.

Description

technical field [0001] The invention mainly relates to the technical field of cooling devices for SMC molded parts, in particular to a water mist vaporization rapid cooling device for SMC parts. Background technique [0002] After the SMC compression molding parts are formed, the parts are in a high-temperature state, and the surface temperature is about 140 °C, and a certain amount of warping will occur during the gradual cooling of the temperature. In order to solve this problem, the current solution is to use tooling to shape the parts. The SMC parts must be supported, and the SMC parts are fixed in the form of pressure points. While setting the shape, a fan is arranged under the tooling to blow the SMC parts to take away the heat and make the surface temperature of the SMC parts reach about 40 ° C for cooling purposes. [0003] Because the cooling process is relatively long, especially in summer, the entire cooling time even reaches 6 minutes, while the molding cycle of ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B29C35/16B29C70/54
CPCB29C35/16B29C70/54B29C2035/1658B29C2035/1691
Inventor 李鹏曹清华孙海明付洋
Owner 杉盛鸿泰复合材料(武汉)有限公司
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