Heat dissipation device and manufacturing method of heat dissipation device
A technology of heat dissipation device and manufacturing method, which is applied to indirect heat exchangers, lighting and heating equipment, etc., and can solve problems such as single mechanism and poor heat dissipation performance
Pending Publication Date: 2020-11-20
GUANGZHOU HUAZUAN ELECTRONICS TECH
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- Description
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Problems solved by technology
[0002] At present, the common cooling device is usually formed by bending a pipe. This type of cooling device has a relatively simple mechanism and poor heat dissipation performance.
Method used
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[0025] This part will describe the specific embodiment of the present invention in detail, and the preferred embodiment of the present invention is shown in the accompanying drawings. Each technical feature and overall technical solution of the invention, but it should not be understood as a limitation on the protection scope of the present invention.
[0026] In the present invention, if there is a description of directions (up, down, left, right, front and back), it is only for the convenience of describing the technical solution of the present invention, rather than indicating or implying that the referred technical features must have specific Orientation, construction and operation in a particular orientation, therefore should not be construed as limiting the invention.
[0027] In the present invention, "several" means one or more, "multiple" means more than two, "greater than", "less than", "exceeding", etc. are understood as excluding the original number; "above", "belo...
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The invention discloses a heat dissipation device and a manufacturing method of the heat dissipation device. The heat dissipation device comprises a heated pipe and a plurality of heat dissipation pipes; the heat dissipation pipes are installed on the side wall of the heated pipe and communicate with the heated pipe, copper powder is arranged on the inner wall of the heated pipe, and the copper powder in the heated pipe is used for adsorbing a heat dissipation medium; the manufacturing method of the heat dissipation device comprises the steps that the heated pipe and the heat dissipation pipeswith the copper powder inside are manufactured; a mounting hole is formed in the upper side of the heated pipe, and a bolt is screwed into the mounting hole; the bolt is subjected to drawing; and oneends of the heat dissipation pipes are embedded into annular flanges and are sealed and fixed. In the using process, heat generated by a heat source is transmitted to the heated pipe, so that the heat dissipation medium in the heated pipe is evaporated into a gas state, the gas-state heat dissipation medium enters the heat dissipation pipes, the heat is released through the heat dissipation pipes, the gas-state heat dissipation medium can be condensed and flow back to the heat dissipation pipes on the inner wall faces of the heat dissipation pipes, therefore, cyclic utilization of the heat dissipation medium is formed, and in this way, the heat dissipation efficiency can be effectively improved through the plurality of heat dissipation pipes.
Description
technical field [0001] The invention is used in the field of heat dissipation devices, and in particular relates to a heat dissipation device and a manufacturing method thereof. Background technique [0002] The current common heat dissipation device is usually formed by bending a pipe, which has a relatively simple structure and poor heat dissipation performance. Contents of the invention [0003] The purpose of the present invention is to at least solve one of the technical problems in the prior art, and provide a heat dissipation device and a manufacturing method thereof, which have better heat dissipation performance. [0004] The technical solution adopted by the present invention to solve the technical problem is: a heat dissipation device, including a heat-receiving pipe and a plurality of heat-dissipating pipes, each of the heat-receiving pipes is installed on the side wall of the heat-receiving pipe and communicated with the heat-receiving pipe, the Copper powder...
Claims
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Login to View More IPC IPC(8): F28D15/04
CPCF28D15/04F28D15/046
Inventor 陈平卢付初高明智
Owner GUANGZHOU HUAZUAN ELECTRONICS TECH