A complex digital module stress damage monitoring and early warning device and method
A digital module and damage monitoring technology, applied in the direction of measuring devices, digital circuit testing, measuring electricity, etc., can solve problems such as no detailed theoretical explanations, achieve low power consumption, reduce dependence, and occupy less logic resources.
Active Publication Date: 2022-06-17
CHINA ELECTRONICS TECH GRP CORP NO 14 RES INST
View PDF7 Cites 0 Cited by
- Summary
- Abstract
- Description
- Claims
- Application Information
AI Technical Summary
Problems solved by technology
At present, there are many literatures describing the use of built-in self-test for solder joint fault detection, but no detailed theoretical explanation is given, and it is a blind spot for actually performing complex digital module solder joint testing
Method used
the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View moreImage
Smart Image Click on the blue labels to locate them in the text.
Smart ImageViewing Examples
Examples
Experimental program
Comparison scheme
Effect test
Embodiment Construction
[0063] The following examples are combined with the attached Figure 1-6 , the technical solutions of the present invention are further described in detail.
[0064] as attached figure 1 As shown, the present invention provides a complex digital module stress damage monitoring and early warning device, the monitoring and early warning device includes a self-test circuit module, a read-write port and a fault monitoring IP core.
[0065] Among them, the self-test circuit module includes external capacitors and grounding. The self-test circuit module short-circuits two adjacent pins distributed in the four corners of the programmable device, and connects to one end of the external capacitor and the other end of the capacitor. Connect to signal ground. At least one self-test circuit module is deployed in each corner of the entire programmable device. The pins closest to the four corners of the programmable device package experience the greatest thermal and mechanical stress, an...
the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More PUM
Login to View More Abstract
The present invention proposes a complex digital module stress damage monitoring and early warning device including a self-test circuit module, a read-write port and a fault monitoring IP core; the self-test circuit module includes an external capacitor and grounding, and one end of the external capacitor is connected to the first pin and the second pin respectively. The pin is connected, and the other end is connected to ground; the read-write port includes two identical read-write logic modules; each read-write logic module includes write logic, read logic, input port and output port; the fault monitoring IP core includes a high-frequency time base A signal source, a threshold controller, a first counter, a second counter, a first latch, a second latch and a read-write controller. The device and method adopted in the present invention can reduce the dependence of device testing on automatic testing equipment, can monitor and quantify the impedance of solder joints online and in real time, and provide credibility through high quantification accuracy and continuous tracking of stress damage higher forecast.
Description
technical field [0001] The invention relates to the technical field of electronic system detection, in particular to a stress damage monitoring and early warning device and method for a complex digital module. Background technique [0002] External stress including vibration, pressure, temperature change, printed board bending and other long-term accumulation are the main reasons for the failure of the digital module solder joint network. However, there is currently a lack of effective technical means to collect health information and monitor the state of circuit board stress degradation. . Solder joints will fail under stress during long-term use, which will cause the entire system to crash in severe cases. Therefore, online monitoring and early prevention of potential risks of welding failure during use can avoid economic losses caused by direct system paralysis. Therefore, a built-in self-test design for solder joint stress damage and fault warning of digital modules is ...
Claims
the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More Application Information
Patent Timeline
Login to View More Patent Type & Authority Patents(China)
IPC IPC(8): G01R31/317G01R27/02
CPCG01R31/317G01R31/31713G01R27/02
Inventor 吕永乐罗京
Owner CHINA ELECTRONICS TECH GRP CORP NO 14 RES INST