A cutting fluid supply device and silicon wafer cutting equipment

Abstract

The present invention provides a device for providing cutting fluid and a device for cutting silicon wafers, which are used to provide cutting fluid during slicing of gold steel wires. The present invention is characterized in that it includes: a mortar tank, which is used for holding a cutting mixture, and the mortar The side of the cylinder is provided with an overflow hole; a liquid addition bucket, which is connected to the mortar tank, is used to hold supplementary cutting fluid to provide the mortar tank with the cutting fluid; a liquid addition control device, so The liquid addition control device includes a liquid inlet pipe and a liquid outlet pipe, the free end of the liquid inlet pipe is communicated with the liquid addition barrel, and the free end of the liquid outlet pipe is adjacent to the bottom of the mortar tank. The cutting fluid supply device of the embodiment of the present invention can ensure the constancy of the concentration of the cutting mixture in the mortar tank, avoid the problem of excessive wear of diamond particles due to the decrease of the concentration of the cutting mixture, and thus can improve the cutting force of the gold steel wire.

Description

technical field [0001] The invention relates to the technical field of gold steel wire slicing, in particular to a cutting fluid supply device and a silicon wafer cutting device having the cutting fluid supply device. Background technique [0002] Since the development of the photovoltaic chip industry, the outer diameter of diamond wire has been reduced from 120μm to the current 47μm, and the 45μm wire is also gradually advancing. Abrasiveness is also reduced simultaneously. In order to improve the cutting ability of the gold steel wire, in addition to the improvement of the performance of the gold steel wire itself, the role of the cutting fluid is also crucial. [0003] The main functions of the cutting fluid are wetting, cooling, and dispersing. We generally use the method of adding directly before cutting during use. In the process of thinning, it is often necessary to cooperate with a large cycle to stabilize cutting, and the large cycle can reduce silicon The powder...

AI Technical Summary

Problems solved by technology

[0003] The main functions of the cutting fluid are wetting, cooling and dispersing. We generally use the method of adding directly before cutting during use. In the process of thinning the wire, it is often combined with a large cycle to stabilize the cutting. The large cycle can reduce silicon The powder and impurities wrap the diamond particles, so that the diamond particles on the diamond wire can fully participate in the cutting, thereby improving the cutting force, but this method only solves the problem of fully utilizing the diamond, and does not consider the weakening of the wear resistance of the diamond particles. decrease, resulting in an increase in the wire breakage rate, which leads to the inability to smoothly advance the thinning work, so we improve this aspect from the perspective of cutting fluid addition method

Images