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A kind of anti-silver migration chip resistor front electrode paste containing nickel-containing alloy powder

A front electrode and alloy powder technology, applied in the direction of resistance terminals/electrodes, conductive materials dispersed in non-conductive inorganic materials, etc., can solve problems such as silver migration

Active Publication Date: 2022-04-08
西安宏星电子浆料科技股份有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0008] In order to solve the serious problem of silver migration existing in the front electrode of the chip resistor, the present invention optimizes the metal powder in the slurry of the front electrode of the chip resistor, and provides an anti-silver migration solution containing nickel-containing alloy powder Chip Resistor Front Electrode Paste

Method used

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  • A kind of anti-silver migration chip resistor front electrode paste containing nickel-containing alloy powder
  • A kind of anti-silver migration chip resistor front electrode paste containing nickel-containing alloy powder
  • A kind of anti-silver migration chip resistor front electrode paste containing nickel-containing alloy powder

Examples

Experimental program
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Effect test

Embodiment 1

[0089] In this embodiment, pastes 1-6 were prepared, the pastes were printed on an alumina substrate and fired to form a substrate, and a silver migration test was performed.

[0090] According to the formula listed in Table 1, the raw materials of the slurry were uniformly mixed and rolled with a three-roll mill to obtain the slurry 1-6. In Table 1, the Ca-Si-Al-B glass powder used is glass powder 6 in Example 2, consisting of 13wt% aluminum oxide, 11wt% zinc oxide, 28wt% silicon oxide, 40wt% calcium oxide It is obtained by smelting at a high temperature of 1100° C. after being uniformly mixed with 8 wt % boron oxide raw materials.

[0091] The prepared slurry 1-6 is printed on a 96% alumina substrate (25mm long × 25mm wide × 1mm thick) by screen printing, and the printed pattern is as follows: figure 1 As shown, the electrode is 4mm long, 2mm wide, and the distance between the two electrodes is 1mm; dry at 150°C for 10 minutes, and then sinter in a belt sintering furnace at...

Embodiment 2

[0097] According to the glass powder formula listed in Table 3, the raw materials of the glass powder were mixed evenly, and then smelted at a high temperature of 1100° C. to obtain glass powder 1-6.

[0098] Glass powder 1-6, contrast glass powder (Asahi glass, brand AGC1370) and silver powder and organic carrier are mixed according to the proportioning of 5wt% glass powder, 70wt% silver powder and 25wt% organic carrier respectively, roll with three-roll mill, obtain Slurry 7-13; wherein, the organic vehicle is the organic vehicle 6 in Example 3, which is composed of 10wt% ethyl cellulose N4, 3wt% phospholipid and 87wt% terpineol.

[0099] The prepared slurry 7-13 is printed on a 96% alumina substrate (25mm long × 25mm wide × 1mm thick) by screen printing, and the printed pattern is as follows: figure 2As shown, dry at 150°C for 10 minutes, then sinter in a belt sintering furnace at a speed of 120mm / min at 850°C, sinter at the peak temperature for 10 minutes, and the total s...

Embodiment 3

[0105] In this embodiment, according to the organic vehicle formula listed in Table 5, the components of the organic vehicle were uniformly mixed to obtain organic vehicles 1-7.

[0106] Organic vehicle 1-7 was mixed with glass powder 6 and silver powder in Example 2 according to the ratio of 27wt% organic vehicle, 3wt% glass powder and 70wt% silver powder, and rolled with a three-roll mill to obtain slurry 14- 20.

[0107] The prepared slurry 14-20 is printed on a 96% aluminum oxide substrate (25mm long * 25mm wide * 1mm thick) by screen printing, and the printed pattern is as follows: figure 2 As shown, dry at 150°C for 10 minutes, then sinter in a belt sintering furnace at a speed of 120mm / min at 850°C, sinter at the peak temperature for 10 minutes, and the total sintering time is 45 minutes to obtain a substrate. The substrates were observed with a metallographic microscope. Put the sintered photo under a metallographic microscope and magnify it 100 times to see if ther...

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Abstract

The invention discloses an anti-silver migration chip resistor front electrode paste, which comprises conductive powder, glass powder and an organic carrier, the conductive powder includes silver powder and nickel-containing alloy powder, and the glass powder is preferably Ca-Si- Al-B series glass powder, the organic vehicle preferably includes ethyl cellulose, phospholipids and terpineol. The chip resistor front electrode paste of the present invention has anti-silver migration ability, and has certain acid resistance and solder resistance, and can provide excellent printability. Use chip resistors.

Description

technical field [0001] The invention belongs to the field of manufacturing products from metal powder, and in particular relates to a silver-migration-resistant chip resistor front electrode paste containing nickel-containing alloy powder. Background technique [0002] Chip resistors, also known as surface mount resistors, are a new generation of miniature electronic components suitable for surface mount technology (SMT). The main application fields of chip resistors are mobile phones, home appliances, cameras, communication equipment, automotive electronics, LEDs, etc. At present, the global sales volume is 300 billion pieces per month, and the annual growth rate is 10%. [0003] At present, the front electrode products of automotive chip resistors of several major domestic manufacturers mainly rely on foreign products, and there is no corresponding electronic paste manufacturer in China, which seriously restricts the development of the chip resistor industry. The research...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01B1/16H01B1/22H01C1/14
CPCH01B1/16H01B1/22H01C1/14
Inventor 梅元王大林徐小艳肖雄陆冬梅曾艳艳吴高鹏赵莹
Owner 西安宏星电子浆料科技股份有限公司