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Plug-in card type case

A plug-in, chassis technology, applied in the direction of using gaseous coolant for modification, cooling/ventilation/heating modification, electrical components, etc. The effect of overhauling, avoiding dumping, and improving heat dissipation efficiency

Active Publication Date: 2020-12-11
北京博睿维讯科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] However, when the wind is flowing in the case, the temperature of the wind is relatively low when it first enters the case. With the contact with the board, the heat generated by the board will be taken away, and the temperature of the wind will increase

Method used

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Examples

Experimental program
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Embodiment Construction

[0041] The following is attached Figure 1-9 The application is described in further detail.

[0042] The embodiment of the present application discloses a plug-in card type chassis. refer to figure 1 , the plug-in card chassis includes a housing 1, a board 2 plugged into the housing 1, and a cooling system 3 arranged on the housing 1 for cooling the board 2 inside the housing 1. The cooling system 3 includes Air cooling system 31 and water cooling system 32.

[0043] The housing 1 includes a bottom plate 11, two side plates 12 fixed on the bottom plate 11, and a top plate 13 fixed on the end of the two side plates 12 away from the bottom plate 11, and two Partition boards 14 , two partition boards 14 are located between the two side boards 12 and both are parallel to the two side boards 12 . Between the opposite side of the two partitions 14 and the two side plates 12, two placement cavities 15 for placing the card 2 are formed, and between the opposite sides of the two p...

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PUM

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Abstract

The invention relates to a plug-in card type case. The case comprises a shell, a board card plugged in the shell and a cooling system arranged in the shell and used for cooling the board card, the shell comprises a bottom board, two side boards fixedly connected to the bottom board and a top board fixedly connected to the ends, away from the bottom board, of the two side boards, and two partitionboards are fixedly connected between the top board and the bottom board. Each partition board is parallel to the corresponding side board, a plurality of installation openings are formed in one side board, the cooling system comprises an air cooling system and a water cooling system, the air cooling system comprises a cooling fan installed in each installation opening, a plurality of air outlets allowing air to flow out are formed in the other side board, and a plurality of circulation openings allowing air to circulate are formed in each partition board. The water cooling system is detachablyintercepted between the two partition boards, and the two columns of board cards are located between the sides, opposite to each other, of the two partition boards and the two side boards respectively. The case has the effects that the heat dissipation efficiency in the case can be improved, and damage to the board card due to untimely heat dissipation is reduced.

Description

technical field [0001] The present application relates to the field of cabinets, in particular to a plug-in card cabinet. Background technique [0002] For the plug-in card chassis, due to the highly integrated functions of the board and the increase in the size of the chassis, the power of the board is also increased, and the number of stacked layers of the boards in the corresponding chassis is also increased, so the cooling capacity of the whole chassis The requirements have also increased significantly. [0003] At present, when cooling the plug-in card case, it mainly relies on the wind direction to dissipate heat from the case. A fan is installed on one side of the case, and the fan blows the outside wind into the case, and passes through the inside of the case from the other side of the case. When the wind passes through the chassis, it also takes away the heat generated by the boards in the chassis, thus playing the role of heat dissipation. [0004] However, when ...

Claims

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Application Information

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IPC IPC(8): H05K7/20
CPCH05K7/20172H05K7/20272H05K7/20209H05K7/20281Y02D10/00
Inventor 张海焦张大勇周清波周肃刘鹏常俊杰许春凤
Owner 北京博睿维讯科技有限公司