Thermally conductive silicone rubber composition, sheet thereof, and production method therefor
A technology of thermal conductivity and composition, applied in chemical instruments and methods, heat exchange materials, textiles and papermaking, etc., can solve the problem of increased hardness, reduced long-term reliability, failure of electronic components and radiators Landfill and other problems, to achieve the effect of low thermal resistance
Inactive Publication Date: 2020-12-11
FUJI POLYMER INDUSTRIES CO LTD
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- Abstract
- Description
- Claims
- Application Information
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Problems solved by technology
For such a thermally conductive composition, it is necessary to contain a large amount of thermally conductive inorganic powder for the ultimate purpose of improving the thermal conductivity of the heat dissipation material. In this case, there are problems that the hardness becomes too high and the gap between the electronic component and the heat sink cannot be set to a predetermined thickness, and the gap between the electronic component and the heat sink cannot be filled as expected.
In addition, in the case of elastomers or gel-like heat sinks, compression set tends to increase and long-term reliability tends to decrease.
Furthermore, there is also a problem that hardness increases due to high-temperature thermal process.
Method used
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Embodiment 1
[0057] (1) Raw material
[0058] (A) Matrix composition
[0059] (A-1) Silicone rubber having a vinyl group: Elkem Japan Co., Ltd., rubber having vinyl groups on both ends and side chains, 80 g
[0060] (A-2) Vinyl silicone oil at both ends: manufactured by Elkem Japan Co., Ltd., viscosity: 350 mm 2 / s(Temperature 25℃)
[0061] (A-3) Silicone oil not having a vinyl group: Dow Corning Toray Co., Ltd., viscosity: 300 cs (temperature: 25° C.)
[0062] (B) Thermally conductive filler
[0063] (B-1) Aluminum nitride (average particle diameter: 10 μm): manufactured by TOYO ALUMINUM K.K.
[0064] (B-2) Alumina (average particle diameter: 12 μm): manufactured by Nippon Light Metal Co., Ltd.
[0065] (B-3) Alumina (average particle diameter: 2 μm): manufactured by Showa Denko Co., Ltd.
[0066] (B-4) Alumina (average particle diameter: 0.3 μm): manufactured by Sumitomo Chemical Co., Ltd.
[0067] (C) Pigment
[0068] "Brown 105A" manufactured by Wacker Asahikasei Silicone
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Abstract
A thermally conductive silicone composition which includes silicones as a matrix ingredient and a thermally conductive filler, wherein the matrix ingredient comprises a silicone base polymer containing a vinyl group and a silicone oil containing no vinyl group, and the thermally conductive filler comprises aluminum nitride particles. The thermally conductive silicone composition further contains aperoxide as a curing ingredient. The thermally conductive silicone sheet 1 of the present invention is obtained by applying the thermally conductive silicone composition (3, 4) to at least one surface of a sized sheet of glass fabric 2 so as to result in a coating thickness of 0.1-1 mm. Thus, a thermally conductive silicone rubber composition and a sheet thereof which are flexible and strong andhave high thermal conductivity and a method for producing the sheet are provided.
Description
technical field [0001] The present invention relates to a thermally conductive silicone rubber composition, a sheet thereof, and a method for producing the same. Background technique [0002] Semiconductors such as computers (CPUs), transistors, and light-emitting diodes (LEDs) emit heat during use, and the performance of electronic components may decrease due to the heat. Therefore, heat sinks are attached to electronic components that emit heat. Since most heat sinks are made of metal, a method of inserting a sheet-like or gel-like thermally conductive composition is used to improve the adhesion between the CPU and the heat sink. For such a thermally conductive composition, it is necessary to contain a large amount of thermally conductive inorganic powder for the ultimate purpose of improving the thermal conductivity of the heat dissipation material. In this case, there are problems that the hardness becomes too high and the gap between the electronic component and the h...
Claims
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IPC IPC(8): C08L83/07B32B7/027B32B17/04B32B27/00B32B27/20C08K3/22C08K3/28C08K5/14C08L83/05
CPCB32B17/04B32B27/00B32B27/20B32B7/027C08G77/20C08K3/10C08K3/22C08K3/28C08K5/14C08K2003/0812C08K2201/001C09D183/04C09K5/14D06N3/0022D06N3/0063D06N3/128D06N2209/062C08L83/04C09D5/00C09D7/61C09D7/68C09D7/69D06N3/0077D06N3/0088
Inventor 小川敏树
Owner FUJI POLYMER INDUSTRIES CO LTD