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Laser machining device, laser machining system, and laser machining method

A technology of laser processing and optical system, applied in metal processing equipment, laser welding equipment, manufacturing tools, etc., can solve problems such as resolution reduction

Active Publication Date: 2020-12-15
极光先进雷射株式会社
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] The spectral line width of the natural oscillation of KrF and ArF excimer laser devices is relatively wide, about 350-400pm. Therefore, the laser light (ultraviolet light) projected onto the wafer through the projection lens on the exposure device side produces chromatic aberration, and resolution rate reduction

Method used

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  • Laser machining device, laser machining system, and laser machining method
  • Laser machining device, laser machining system, and laser machining method
  • Laser machining device, laser machining system, and laser machining method

Examples

Experimental program
Comparison scheme
Effect test

Embodiment approach 1

[0065] 4.1 Structure

[0066] 4.2 Action

[0067] 4.3 Function / Effect

Embodiment approach 2

[0069] 5.1 Structure

[0070] 5.2 Action

[0071] 5.3 Function / Effect

[0072] 6. Modified example of dust collection system for purge gas flow

[0073] 6.1 Modification 1

[0074] 6.1.1 Structure

[0075] 6.1.2 Action

[0076] 6.1.3 Function / Effect

[0077] 6.2 Modification 2

[0078] 6.2.1 Structure

[0079] 6.2.2 Action

[0080] 6.2.3 Function / Effect

[0081] 6.3 Modification 3

[0082] 6.3.1 Structure

[0083] 6.3.2 Actions

[0084] 6.3.3 Function / Effect

[0085] 6.4 Modification 4

[0086] 6.4.1 Structure

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[0088] 6.4.3 Function / Effect

[0089] 7. Example of fly eye lens

[0090] 7.1 Structure

[0091] 7.2 Action

[0092] 7.3 Others

[0093] 8. Specific examples of laser processing conditions

[0094] Embodiments of the present disclosure will be described in detail below with reference to the drawings. The embodiment described below shows some examples of the present disclosure, and does not limit the content of the present di...

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PUM

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Abstract

A laser machining device according to one aspect of the present disclosure comprises: a placement table onto which an object to be machined is placed; an optical system for guiding a laser beam to theobject to be machined that is placed on the placement table; a gas supply port for supplying a gas to the periphery of a laser light irradiation region on the object to be machined; a gas recovery port for recovering the gas supplied from the gas supply port; a moving device for moving the laser light irradiation region on the object to be machined; and a control device for controlling the direction of the gas flow of the gas flowing from the gas supply port to the gas recovery port according to the moving direction of the irradiation region. The control device changes the direction of the gas flow so that the gas flows in a direction opposite to the movement direction of the irradiation region, along with the change of the movement direction of the irradiation region due to the moving device.

Description

technical field [0001] The present disclosure relates to a laser processing device, a laser processing system, and a laser processing method. Background technique [0002] With the miniaturization and high integration of semiconductor integrated circuits, improvement in resolution is required in semiconductor exposure apparatuses. Hereinafter, the semiconductor exposure apparatus is simply referred to as “exposure apparatus”. Therefore, shortening of the wavelength of light output from the light source for exposure is progressing. A gas laser device is used as a light source for exposure instead of a conventional mercury lamp. Currently, as a gas laser device for exposure, a KrF excimer laser device that outputs ultraviolet rays with a wavelength of 248 nm and an ArF excimer laser device that outputs ultraviolet rays with a wavelength of 193 nm are used. [0003] As a current exposure technology, liquid immersion exposure has been put into practical use by filling the gap...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B23K26/142
CPCB23K26/142B23K26/362B23K26/402B23K26/1462B23K26/126
Inventor 诹访辉若林理新堀真史小林正和
Owner 极光先进雷射株式会社