A kind of alarm method of semiconductor equipment
A semiconductor and equipment technology, applied in the field of semiconductor equipment alarm, can solve the problems of wafer quality decline and wafer temperature rise, and achieve the effect of improving yield and quality
Active Publication Date: 2021-05-14
晶芯成(北京)科技有限公司
View PDF7 Cites 0 Cited by
- Summary
- Abstract
- Description
- Claims
- Application Information
AI Technical Summary
Problems solved by technology
After the manufacturer manufactures the wafer, it will process the wafer according to the customer's requirements, such as destaticizing the wafer or curing the photoresist, but when the wafer is exposed to light for a long time in the cavity without any prompt When the temperature of the wafer increases, the quality of the wafer decreases, and the yield rate of the chip
Method used
the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View moreImage
Smart Image Click on the blue labels to locate them in the text.
Smart ImageViewing Examples
Examples
Experimental program
Comparison scheme
Effect test
Embodiment Construction
[0062] Embodiments of the present invention are described below through specific examples, and those skilled in the art can easily understand other advantages and effects of the present invention from the content disclosed in this specification. The present invention can also be implemented or applied through other different specific implementation modes, and various modifications or changes can be made to the details in this specification based on different viewpoints and applications without departing from the spirit of the present invention.
[0063] It should be noted that the diagrams provided in this embodiment are only schematically illustrating the basic idea of the present invention, and only the components related to the present invention are shown in the diagrams rather than the number, shape and shape of the components in actual implementation. Dimensional drawing, the type, quantity and proportion of each component can be changed arbitrarily during actual impleme...
the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More PUM
| Property | Measurement | Unit |
|---|---|---|
| diameter | aaaaa | aaaaa |
| surface area | aaaaa | aaaaa |
| size | aaaaa | aaaaa |
Login to View More
Abstract
The present invention proposes a semiconductor device and an alarm method, including: a cavity; a stage located at the bottom of the cavity; a light source located at the top of the cavity; a collector, located on one side of the baffle, for forming a pulse signal; a signal receiver, located on the outside of the cavity, connected to the signal collector, for receiving the pulse signal; an alarm, located The outside of the cavity is connected with the signal receiver. The semiconductor device proposed by the present invention can avoid the temperature rise of the wafer surface when the wafer stays in the cavity for a long time, and can also avoid the abnormality of the photoresist pattern on the wafer surface; the semiconductor device proposed by the present invention can also play a role To the role of automatic alarm, but also can calculate the number of wafers produced.
Description
technical field [0001] The invention relates to the technical field of semiconductors, in particular to an alarm method for semiconductor equipment. Background technique [0002] Wafer is one of the most important materials in the semiconductor industry. Products with specific electrical functions can be formed by forming various circuit component structures on the wafer. After the manufacturer manufactures the wafer, it will process the wafer according to the customer's requirements, such as destaticizing the wafer or curing the photoresist, but when the wafer is exposed to light for a long time in the cavity without any prompt When the temperature of the wafer is increased, the quality of the wafer is reduced, and the yield rate of the chip is reduced. Contents of the invention [0003] In view of the above-mentioned defects in the prior art, the present invention proposes a semiconductor device and an alarm method thereof. The semiconductor device can monitor the trans...
Claims
the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More Application Information
Patent Timeline
Login to View More Patent Type & Authority Patents(China)
IPC IPC(8): H01L21/67G08B21/18
CPCG08B21/18G08B21/185H01L21/67242H01L21/67276
Inventor 许时斌牛振标李昶材
Owner 晶芯成(北京)科技有限公司