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Multifunctional integrated test bed

A test bench and multi-functional technology, applied in laboratory stools/lab benches, material thermal analysis, instruments, etc., can solve the problems of low service life of tools, high electricity consumption in waste water pools, easy oxidation and rust of tools, etc. To achieve the effect of improving service life and compact structure

Pending Publication Date: 2020-12-22
HUIZHOU TECHUANG ELECTRONIC TECH CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

In order to facilitate the test, a tool box for storing test tools is set under the body of the thermal stress test bench. During such a long-term use, the tools are easily oxidized and rusted due to the influence of high temperature, resulting in a low service life of the tools
[0003] In addition, during the slice grinding test, a large amount of waste water will be generated, and the waste water from the grinding test bench is directly discharged into the waste water pool, which makes the equipment in the waste water pool work continuously, resulting in more power consumption in the waste water pool

Method used

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Embodiment Construction

[0033] In order to facilitate the understanding of the present invention, the present invention will be described more fully below with reference to the associated drawings. Preferred embodiments of the invention are shown in the accompanying drawings. However, the present invention can be embodied in many different forms and is not limited to the embodiments described herein. On the contrary, the purpose of providing these embodiments is to make the disclosure of the present invention more thorough and comprehensive.

[0034] It should be noted that when an element is referred to as being “fixed” to another element, it can be directly on the other element or there can also be an intervening element. When an element is referred to as being "connected to" another element, it can be directly connected to the other element or intervening elements may also be present. The terms "vertical," "horizontal," "left," "right," and similar expressions are used herein for purposes of ill...

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Abstract

The invention provides a multifunctional integrated test bed. The multifunctional integrated test bed comprises a base plate, a machine body, a box body, a door body, a thermal stress test seat and agrinding seat, wherein a through hole is formed in the base plate; the machine body is connected with the base plate and bears the base plate, the machine body is provided with a first containing groove, a first storage cavity, a heat insulation cavity and a containing groove, the first containing groove communicates with the through hole, the first containing groove and the heat insulation cavityboth communicate with the first storage cavity, and the heat insulation cavity communicates with the containing groove; and the box body is provided with an open groove and a storage groove which arecommunicated, the storage groove is used for storing tools, and the outer wall of the box body is separated from the base plate through the heat insulation cavity. The thermal stress test seat and the grinding seat are integrated on the same base plate, so that the structure of the multifunctional integrated test bed is compact; and the outer wall of the box body is separated from the base platethrough the heat insulation cavity, so that little heat of the base plate is conducted into the box body, the problem that tools are prone to oxidation and rusting due to the too high temperature in the box body is solved, and the service life of the tools is prolonged.

Description

technical field [0001] The invention relates to the technical field of circuit board testing, in particular to a multifunctional integrated testing platform. Background technique [0002] The tests that the circuit board test bench is used for include thermal stress test tests and slice grinding tests. Among them, the thermal stress test is divided into products corresponding to two different tin furnaces with lead and lead-free. In foreign countries such as the European Union, the environmental indicators are higher, and more lead-free tin furnaces are generally used, and the thermal stress requires tin furnaces. The temperature is 288°C / 10″ for 3 times. The tin-eating experiment requires the temperature of the tin furnace to be 255°C, and the tin in the tin furnace cannot be mixed. That is to say, the thermal stress test bench needs to be tested at high temperature, so that the body of the thermal stress test bench The temperature is high. In order to facilitate the test,...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G01N25/00G01N19/00B01L9/02
CPCG01N25/00G01N19/00B01L9/02
Inventor 许校彬郭卫军唐帅
Owner HUIZHOU TECHUANG ELECTRONIC TECH CO LTD