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Conductive substrate and manufacturing method thereof

A kind of conductive substrate, technology of manufacturing method

Active Publication Date: 2022-03-22
DEYI PRECISION ELECTRONIC IND CO LTD PANYU
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

In this scheme, the insulating fibers have been cooled and solidified before lamination, and because the insulating fibers are randomly distributed, the contact area between the insulating layer and the conductor and another insulating layer is small, so the bonding force of the non-woven insulating layer is relatively strong. weak

Method used

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  • Conductive substrate and manufacturing method thereof
  • Conductive substrate and manufacturing method thereof
  • Conductive substrate and manufacturing method thereof

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Embodiment Construction

[0041] In order to facilitate a better understanding of the purpose, structure, features, and effects of the present invention, the present invention will now be further described in conjunction with the accompanying drawings and specific embodiments.

[0042]The so-called conductive substrate 100 in the present invention includes flexible flat cable (FFC), flexible circuit board (FPC), rigid printed circuit board (PCB) and other plate-shaped electronic equipment with a certain length of conductive circuit, which includes at least one plane A plurality of conductive elements 1 arranged side by side, such as copper wires, etched copper layers, etc., serve as a circuit for transmitting electrical signals, wherein two adjacent conductive elements 1 have a gap. The conductive substrate 100 also includes an insulating layer 2 covering a plurality of the conductive elements 1, the insulating layer 2 is composed of a large number of insulating fibers 3 stacked randomly, and the insula...

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Abstract

The invention discloses a conductive substrate, comprising: a plurality of conductive elements arranged side by side; and an insulating layer covering at least one side of the plurality of conductive elements, the insulating layer includes insulating fibers and gaps distributed between the insulating fibers. The invention also discloses a manufacturing method of the conductive base material, which includes: providing a plurality of conductive elements and a melt-blown device arranged side by side, providing insulating materials to the two melt-blown devices, making them spray out molten insulating fibers, and melt-blown The device sprays molten insulating fibers to stack and form the insulating layer. The molten insulating fibers are welded to each other in the gap between multiple conductive elements or to an insulating base layer on which the conductive elements are pre-fixed. Multiple conductive elements are covered by the insulating layer. Form a conductive substrate.

Description

【Technical field】 [0001] The invention relates to a conductive substrate and a manufacturing method thereof, in particular to a conductive substrate including insulating fibers and a manufacturing method thereof. 【Background technique】 [0002] The known flexible flat cable (Flexible Flat Cable) includes a plurality of copper wires arranged side by side and an insulating layer wrapping the plurality of copper wires. The insulating layer is a continuous dense film made of commonly used insulating materials such as PET. The flexible cable is made by lamination process, and the direction perpendicular to the side-by-side direction of the copper wires is used as the pressing direction, and multiple copper wires are placed between the two insulating layers, and then pressed together, so that the insulating layer is covered on the A plurality of the copper wires form the flexible flat wire. In order to reduce the influence of the insulating layer on the transmission signals in co...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01B7/02H01B7/08H01B7/04H01B13/06H01B13/12
CPCH01B7/02H01B7/08H01B7/0216H01B7/04H01B13/06H01B13/12
Inventor 何德佑
Owner DEYI PRECISION ELECTRONIC IND CO LTD PANYU
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