Looking for breakthrough ideas for innovation challenges? Try Patsnap Eureka!

Diode device with high sealing performance and automatic acid pickling function

A sealing and diode technology, applied in electrical components, semiconductor/solid-state device manufacturing, circuits, etc., can solve the problems of low automation and low reliability, and achieve the effect of high automation, high reliability and improved stability

Inactive Publication Date: 2020-12-25
张昌林
View PDF0 Cites 0 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] Aiming at the deficiencies of the prior art, the present invention provides a diode device with high sealing performance and automatic pickling function, which has the advantages of high sealing performance and automatic pickling, and solves the problem of low automation and low reliability of traditional equipment. The problem

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Diode device with high sealing performance and automatic acid pickling function
  • Diode device with high sealing performance and automatic acid pickling function
  • Diode device with high sealing performance and automatic acid pickling function

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0025] The following will clearly and completely describe the technical solutions in the embodiments of the present invention with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only some, not all, embodiments of the present invention. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without making creative efforts belong to the protection scope of the present invention.

[0026] see Figure 1-5 , a diode device with high sealing performance and automatic pickling function, comprising a body 1, the top of the body 1 is movably connected with an adapter seat 2, the front end of the body 1 is movably connected with a clip 3, and the bottom of the clip 3 is movably connected There is a stable component 4, the lower part of the stable component 4 is movably connected with a turntable 5, the outer frame of the turntable 5 is movably ...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

The invention relates to the technical field of diode packaging, and discloses a diode device with high sealing performance and an automatic acid pickling function. The top end of a body is movably connected with an adaptive seat, the front end of the body is movably connected with a clamping piece, and the bottom end of the clamping piece is movably connected with a stabilizing component. According to the diode device with the high sealing performance and the automatic acid pickling function, the fixing piece is inserted into the bottom end body, the fixing piece, a strong spring, a hook, a pushing component and a driver are used in cooperation, and the driver operates upwards under the influence of interaction force, so that the negative electrode and the positive electrode are subjectedto acid pickling through a metal pipe; and a gear on the outer side of an adjusting disc and a gear on the outer side of a driving rod interact with each other to continuously adjust the high temperature generated inside and prevent the diode device from being burnt out, so that the stability of the device is improved, and the device has the effects of automatic acid pickling, stability improvement, high automation degree and no influence on the quality of the diode.

Description

technical field [0001] The invention relates to the technical field of diode packaging, in particular to a diode device with high sealing performance and automatic pickling function. Background technique [0002] Diode, also known as crystal diode or LED lamp, is an electronic device made of semiconductor materials. It is generally used as a light source for a lamp. It has unidirectional conductivity, that is, a forward voltage is applied to the anode and cathode of the diode. , the diode conducts, and the conduction and cut-off of the diode is equivalent to the on and off of the switch. Among them, the diode is the most widely used in electronic circuits. [0003] As users have higher and higher requirements for diodes, users' demand for high-quality diodes has become increasingly prominent. At present, most diodes are packaged in epoxy packaging, which has low reliability and cannot meet the needs of users. Not only that , Most of the traditional diode devices do not have...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Applications(China)
IPC IPC(8): H01L21/67H01L33/00H01L29/861
CPCH01L21/67126H01L29/861H01L33/00
Inventor 张昌林
Owner 张昌林
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Patsnap Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Patsnap Eureka Blog
Learn More
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com