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Display substrate and preparation method thereof, and display device

A technology for display substrates and display areas, applied in semiconductor devices, electrical components, circuits, etc., can solve the problems of poor thermal conductivity, failure, fixed thermal conduction position, etc., to achieve high thermal conduction efficiency, increase service life, and reduce the effect of temperature

Active Publication Date: 2021-11-09
BOE TECH GRP CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

At present, because Micro LEDs will generate a lot of heat during use, if the heat cannot be dissipated in time, it will cause the temperature of the QD luminescent material to rise, reduce the service life of the QD luminescent material, and seriously cause failure
Although the above-mentioned problems can be partially alleviated by heat conduction structures such as metal strips, the heat conduction effect is poor due to the fixed heat conduction position

Method used

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  • Display substrate and preparation method thereof, and display device
  • Display substrate and preparation method thereof, and display device
  • Display substrate and preparation method thereof, and display device

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Embodiment Construction

[0049] In order to make the purpose, technical solution and advantages of the present disclosure clearer, the embodiments of the present disclosure will be described in detail below in conjunction with the accompanying drawings. It should be noted that, in the case of no conflict, the embodiments in the present disclosure and the features in the embodiments can be combined arbitrarily with each other.

[0050] In the drawings, the size of each component, the thickness of a layer, or a region is sometimes exaggerated for the sake of clarity. Therefore, one aspect of the present disclosure is not necessarily limited to the dimensions, and the shapes and sizes of components in the drawings do not reflect actual scales. In addition, the drawings schematically show ideal examples, and one aspect of the present disclosure is not limited to shapes, numerical values, and the like shown in the drawings.

[0051] Ordinal numerals such as "first", "second", and "third" in this specifica...

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Abstract

This paper discloses a display substrate, a preparation method thereof, and a display device. The display substrate includes: a base substrate, a heat dissipation structure layer and a pixel unit arranged on the base substrate, the heat dissipation structure layer includes a flow guide channel, a liquid storage tank, and a cooling liquid, and the display substrate includes a display area and a peripheral area located on the periphery of the display area , the pixel unit is located in the display area, the diversion channel surrounds the pixel unit, the liquid storage tank is located in the peripheral area and communicates with the diversion channel, and the cooling liquid is filled in the diversion channel and the liquid storage tank. In this paper, by setting the heat dissipation structure layer, the flow guide channel of the heat dissipation structure layer surrounds the pixel unit, and the cooling liquid in the flow guide channel can cool the pixel unit. Compared with the heat dissipation method of the heat conduction sheet, this method has higher heat conduction efficiency and can reduce the The temperature of the display area, thereby increasing the service life of the pixel unit.

Description

technical field [0001] The present disclosure relates to but not limited to the field of display technology, and more specifically, relates to a display substrate, a manufacturing method thereof, and a display device. Background technique [0002] The combination of photoinduced quantum dot (Quantum Dot, QD) luminescent material and Micro LED is a very ideal quantum dot display structure, which can bring excellent brightness and color gamut. At present, because Micro LEDs will generate a lot of heat during use, if the heat cannot be dissipated in time, it will cause the temperature of the QD luminescent material to rise, reduce the service life of the QD luminescent material, and seriously cause failure. Although the above-mentioned problems can be partially alleviated by a heat conduction structure such as a metal strip, the heat conduction effect is poor because the heat conduction position is fixed. Contents of the invention [0003] The following is an overview of the...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L33/64H01L27/15
CPCH01L27/156H01L33/642H01L33/648H01L2933/0075
Inventor 赵德江黄维
Owner BOE TECH GRP CO LTD