Spring type packaging structure

A packaging structure, spring-type technology, applied in the field of spring-type packaging structure, can solve the problems of high development cost, waste of resources, environmental damage, etc., and achieve the effect of saving transportation costs, increasing the amount of cabinets, and saving volume
CN112173389AInactive Publication Date: 2021-01-05TPV ELECTRONICS (FUJIAN) CO LTD
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Patent Information

Authority / Receiving Office
CN ยท China
Patent Type
Applications(China)
Current Assignee / Owner
TPV ELECTRONICS (FUJIAN) CO LTD
Publication Date
2021-01-05
Estimated Expiration
Not applicable ยท inactive patent

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Abstract

The invention discloses a spring type packaging structure. The spring type packaging structure involves a box body, wherein damping and buffering assemblies are arranged on at least two opposite sidefaces of the box body, and each damping and buffering assembly comprises a buffer plate A, a buffer plate B and at least one spring; and the springs are fixedly connected between the buffer plates A and the buffer plates B, the buffer plates A make contact with the side faces of the box body, and the buffer plates B make contact with a to-be-packaged object. According to the spring type packagingstructure, packing materials are simple in design, only the size and weight factors of the object need to be considered, and the damping and buffering assemblies can be designed to be very thin as long as the bearing force is enough so that the size of a packing box can be reduced, and the loading quantity is greatly increased; and all the packing materials can be recycled, so that the purpose ofenvironmental protection is achieved.
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Description

technical field

[0001] The invention belongs to the technical field of packaging boxes, and in particular relates to a spring-type packaging structure. Background technique

[0002] At present, MNT\TV\PD uses a large amount of packaging materials such as EPS\EPE\EPU, which takes up a large volume of packaging space, and the packaging materials cannot be reused, causing environmental damage and a large amount of waste of resources. In addition, the use of EPS packaging requires mold costs, which has the disadvantages of long development cycles and high development costs. Contents of the invention

[0003] The purpose of the present invention is to overcome the deficiencies of the prior art and provide a spring-type packaging structure.

[0004] To achieve the above object, the present invention adopts the following technical solutions:

[0005] A spring-type packaging structure, which includes a box, at least two opposite sides of the box are provided with a shock-absorbi...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
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