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Pressing device and LED packaging process

A technology of pressing equipment and packaging technology, which is applied in the direction of electrical components, electrical solid devices, circuits, etc., can solve problems such as inconsistent installation angles, light deviation from the preset direction, uneven light mixing of LED integrated light sources, etc., and achieve uniform light mixing , Improve the luminous performance, the effect of good color viewing angle

Pending Publication Date: 2021-01-05
SHENZHEN TCL NEW-TECH CO LTD
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  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] The main purpose of the present invention is to provide a pressing device, which aims to solve the problem that in the prior art, the installation angle of each LED chip in the LED integrated light source is inconsistent, so that the light emitted by each LED deviates from the preset direction, causing the entire The problem of uneven light mixing of LED integrated light source

Method used

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  • Pressing device and LED packaging process
  • Pressing device and LED packaging process
  • Pressing device and LED packaging process

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Embodiment Construction

[0037] The following will clearly and completely describe the technical solutions in the embodiments of the present invention with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of them. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without creative efforts fall within the protection scope of the present invention.

[0038] It should be noted that all directional indications (such as up, down, left, right, front, back...) in the embodiments of the present invention are only used to explain the relationship between the various devices in a certain posture (as shown in the figure). Relative positional relationship, movement conditions, etc., if the specific posture changes, the directional indication will also change accordingly.

[0039] In addition, the descriptio...

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Abstract

The invention provides a pressing device and an LED packaging process, and the pressing device is applied to an LED packaging system. The pressing device comprises: a frame; a bearing plate which is arranged on the machine frame; a press-fit device which is arranged on the rack corresponding to the bearing plate, wherein a press-fit surface is arranged on the press-fit device, a press-fit stationis arranged on the bearing plate, and the press-fit surface faces the press-fit station; a pressure applying device which is arranged on the bearing plate and / or the pressing device. According to thepressing device, the light-emitting angles of all the LEDs are consistent, preset mixed light such as white light can be obtained when the light rays of all the LEDs are mixed, the purpose of uniformlight mixing is achieved, the light-emitting performance of the LED integrated light source is improved, and the whole LED integrated light source has a good color visual angle.

Description

technical field [0001] The invention relates to the technical field of LED packaging, in particular to a pressing device and an LED packaging process. Background technique [0002] COB (Chip On Board) is a high-efficiency integrated surface light source technology that directly attaches the chip to a mirror metal substrate with high reflectivity. The average performance is stable, so COB technology occupies a very high application rate in the production and manufacture of LEDs. In the COB process, it is necessary to use a die-bonding machine. After the pads are printed on the substrate, the die-bonding machine fixes the LED chips on the pads. Since each LED chip is individually fixed by the die-bonding machine, In the prior art, after all the LED chips have completed the crystal-bonding step, the installation angle of each LED chip is inconsistent (there is a difference in the amount of solder used on each pad, which causes different attraction to the LED chip pins, and whe...

Claims

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Application Information

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IPC IPC(8): H01L33/48H01L33/62H01L21/98H01L25/075
CPCH01L33/48H01L33/62H01L25/50H01L25/0753H01L2933/0033H01L2933/0066
Inventor 林健源
Owner SHENZHEN TCL NEW-TECH CO LTD
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