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Electroplating bath current shielding device and electroplating system

A technology of current shielding and electroplating tanks, which is applied in the direction of current insulation devices, electrolysis processes, electrolysis components, etc., can solve problems such as failure to meet customer requirements, achieve the effect of improving product quality and reducing current edge effects

Pending Publication Date: 2021-01-08
崇辉半导体(深圳)有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

During the electroplating process of the bracket, due to the current edge effect, the plating thickness of the electroplated product is thick on both sides and thin in the middle, which cannot meet customer requirements

Method used

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  • Electroplating bath current shielding device and electroplating system
  • Electroplating bath current shielding device and electroplating system
  • Electroplating bath current shielding device and electroplating system

Examples

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Embodiment Construction

[0019] The application provides a current shielding device for an electroplating tank.

[0020] In order to enable those skilled in the art to better understand the solution of the present application, the technical solution in the embodiment of the application will be clearly and completely described below in conjunction with the accompanying drawings in the embodiment of the application. Obviously, the described embodiment is only It is an embodiment of a part of the application, but not all of the embodiments. Based on the embodiments in this application, all other embodiments obtained by persons of ordinary skill in the art without creative efforts shall fall within the scope of protection of this application.

[0021] In order to facilitate the understanding of those skilled in the art, the present application describes the specific implementation process of the technical solution provided by the present application through the following examples.

[0022] figure 1 It i...

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PUM

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Abstract

The invention discloses an electroplating bath current shielding device. The device comprises at least two installation frames, a first shielding plate, a second shielding plate, a third shielding plate and a fourth shielding plate, the at least two installation frames comprise the first installation frame and the second installation frame, and the first shielding plate, the second shielding plate, the third shielding plate and the fourth shielding plate are fixedly connected between the first installation frame and the second installation frame. The first shielding plate and the second shielding plate are obliquely and symmetrically arranged along an electroplating piece, the third shielding plate and the fourth shielding plate are obliquely and symmetrically arranged along the electroplating piece, the first shielding plate and the third shielding plate are arranged in a spaced manner, the second shielding plate and the fourth shielding plate are arranged in a spaced manner, and through holes are formed in the first shielding plate, the second shielding plate, the third shielding plate and the fourth shielding plate. The electroplating piece comprises a first side edge and a second side edge, the distance between the first shielding plate and the electroplating piece is gradually increased, and the distance between the third shielding plate and the electroplating piece is gradually decreased. The electroplating bath current shielding device can reduce the current edge effect. The invention further relates to an electroplating system.

Description

technical field [0001] The invention relates to the technical field of electroplating, in particular to an electroplating tank current shielding device and an electroplating system. Background technique [0002] The electroplating of the surface-mounted LED bracket is one of the key links in the entire production of the surface-mounted light-emitting diode. During the electroplating process of the bracket, due to the existence of the current edge effect, the thickness of the electroplated product is thick on both sides and thin in the middle, which cannot meet the customer's requirements. Contents of the invention [0003] In view of this, the present invention provides a current shielding device for an electroplating tank, which can reduce the edge effect of the current, make the thickness uniformity of the electroplating sheet coating meet customer requirements, and improve product quality. [0004] A current shielding device for an electroplating bath, used for current...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C25D17/00
CPCC25D17/008
Inventor 罗小平郑建国
Owner 崇辉半导体(深圳)有限公司
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