Thin film sensing structure, temperature sensor and electronic equipment

Abstract

The invention discloses a film sensing structure, a temperature sensor and electronic equipment, and the structure comprises a substrate which is provided with a first surface which is provided with afirst metal circuit and a second metal circuit, and one end of the first metal circuit is connected with one end of the second metal circuit to form a thermoelectric junction. The other end of the first metal circuit is connected with the first binding block, the other end of the second metal circuit is connected with the second binding block, the first binding block and the second binding blockare used for being externally connected with a circuit, and the first metal circuit and the second metal circuit extend in the first direction. A first metal circuit and a second metal circuit are arranged on a base material, one end of the first metal circuit is connected with one end of the second metal circuit, and the other end of the first metal circuit and the other end of the second metal circuit are communicated with the outside through a first binding block and a second binding block respectively. Therefore, signals on the thin film induction structure can be transmitted to the outside from the first binding block and the second binding block, and the signal transmission of the thin film induction structure is relatively stable.

Description

Technical field[0001]The present invention relates to the technical field of sensing structures, in particular to a thin film sensing structure, a temperature sensor and electronic equipment.Background technique[0002]In related technologies, there are applications of sensing films in mobile phone pressure sensing, medical equipment, automobiles, health monitoring machinery and other fields, which have broad application prospects. In the design and production of sensing films, due to the preferential production of sensing film patterns, Then the copper film is plated on the outer layer of the circuit pattern, which will bury potential safety hazards at the overlapping position of the copper film and the circuit pattern, thereby increasing the crack probability of the copper film and reducing the signal transmission effect of the copper film.Summary of the invention[0003]The present invention aims to solve at least one of the technical problems existing in the prior art. To this end, ...

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Problems solved by technology

[0002] In related technologies, there are applications of sensing films in the fields of mobile phone pressure sensitivity, medical equipment, automobiles, health monitoring machinery, etc., and have broad application prospects. When designing and manufacturing sensing films, the pattern of sensing films is preferentially produced. Then, the copper film is plated on the outer layer of the circuit pattern, which will bury a safety hazard at the overlapping position of the copper film and the circuit pattern, thereby increasing the crack probability of the copper film and reducing the signal transmission effect of the copper film.

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