Ceramic capacitive pressure sensor and preparation method thereof

A pressure sensor, ceramic capacitor technology, applied in the fluid pressure measurement, instrument, measurement force and other directions using capacitance change, can solve the problems of low output reliability, undetectable, unable to guarantee filling of the cavity, etc., to achieve output reliability. improved effect

Pending Publication Date: 2021-01-15
常州盛士达传感器有限公司
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  • Abstract
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  • Application Information

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Problems solved by technology

In fact, after filling the hole, it is necessary to deglue the silver glue to achieve the purpose of curing. However, due to th

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  • Ceramic capacitive pressure sensor and preparation method thereof
  • Ceramic capacitive pressure sensor and preparation method thereof
  • Ceramic capacitive pressure sensor and preparation method thereof

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Embodiment Construction

[0036] The specific implementation manners of the present invention will be further described in detail below in conjunction with the accompanying drawings and embodiments. The following examples are used to illustrate the present invention, but are not intended to limit the scope of the present invention.

[0037] see Figure 1 to Figure 5 , a ceramic capacitive pressure sensor according to a preferred embodiment of the present invention, comprising a thick ceramic substrate (1), a thin ceramic substrate (2),

[0038] The thick ceramic substrate (1) and the thin ceramic substrate (2) are bonded and fixed through a glass paste bonding layer (5), and a plurality of grooves (4) are opened on the side edge of the thick ceramic substrate (1) , there are 3 grooves (4), each of which is filled with an L-shaped conductive sheet (3), between the conductive sheet (3) and the groove (4) Through the conductive connection of silver glue, there is also a pad (6) on the top groove of the ...

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Abstract

The invention relates to a ceramic capacitive pressure sensor and a preparation method thereof, and belongs to the technical field of sensor preparation. The ceramic capacitive pressure sensor comprises a thick ceramic substrate and a thin ceramic substrate, the thick ceramic substrate and the thin ceramic substrate are bonded and fixed through a glass paste bonding layer, a plurality of grooves are formed in the side edge of the thick ceramic substrate, each groove is filled with an L-shaped conducting strip, the conducting strips and the grooves are conductively connected through elargol, and a bonding pad is further arranged at the groove position of the top of the thick ceramic substrate and used for being connected with the conducting strip to achieve the transition connection effect.According to the ceramic capacitive pressure sensor, the groove is cut in the side edge of the thick ceramic substrate, the groove is filled with the conducting strip, and the groove cavity is filledwith the conductive silver adhesive between the conducting strip and the groove, so that the ceramic capacitive pressure sensor is not influenced by air pressure, the groove cavity can be filled withthe conductive silver adhesive, meanwhile, visual detection can be carried out, and the output reliability of the sensor is obviously improved.

Description

technical field [0001] The invention relates to a ceramic capacitive pressure sensor and a preparation method thereof, belonging to the technical field of sensor preparation. Background technique [0002] At present, ceramic capacitive pressure sensors are equipped with electrodes on the opposite surfaces of two thick and thin ceramic substrates, and ceramic balls, resin balls, low-temperature co-fired (LTCC) ceramic green sheets, etc. are used as spacers to control the distance between the electrodes. , to form a plate capacitor with a specified initial capacitance. When the ceramic substrate is subjected to external pressure, the thin substrate will bend and deform along the thickness direction of the plate, resulting in a change in capacitance value. According to the change value of this capacitance, the external pressure on the substrate can be detected. [0003] However, the existing ceramic pressure sensors all use the via hole process. First, the gold paste is printe...

Claims

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Application Information

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IPC IPC(8): G01L1/14G01L9/12
CPCG01L1/142G01L9/12
Inventor 景杰殷捷许正昌王清新
Owner 常州盛士达传感器有限公司
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