Semiconductor package, semiconductor assembly and method for fabricating a semiconductor package
A technology of semiconductors and packages, applied in semiconductor/solid-state device manufacturing, semiconductor devices, semiconductor/solid-state device components, etc., can solve the problems of negative impact on heat dissipation efficiency, large thermal resistance of application boards, etc.
Pending Publication Date: 2021-01-15
INFINEON TECH AG
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- Abstract
- Description
- Claims
- Application Information
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Problems solved by technology
However, the application board may have considerable thermal resistance, which may negatively affect thermal efficiency
Method used
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example 1
[0060] Example 1 is a semiconductor package comprising: a chip carrier, a semiconductor chip attached to the chip carrier, an encapsulation enclosing the semiconductor chip, and an encapsulation configured to receive a heat sink for screw mounting to the chip carrier. Mounting holes for screws on a first side of a semiconductor package, wherein a second side of the semiconductor package opposite the first side is configured to be surface mountable to an application board.
example 2
[0061] Example 2 is the semiconductor package of example 1, wherein the mounting hole extends completely through the semiconductor package from the first side to the second side.
example 3
[0062] Example 3 is the semiconductor package of examples 1 or 2, wherein the chip carrier is exposed at the encapsulation at the first side of the semiconductor package.
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A semiconductor package is disclosed. In one example, the semiconductor package includes a chip carrier, a semiconductor chip attached to the chip carrier, an encapsulation body encapsulating the semiconductor chip, and a mounting hole configured to receive a screw for screw mounting a heatsink onto a first side of the semiconductor package. A second side of the semiconductor package opposite thefirst side is configured to be surface mounted to an application board.
Description
technical field [0001] The present disclosure generally relates to a semiconductor package, a semiconductor assembly, and a method for making a semiconductor package. Background technique [0002] Semiconductor packages, especially power semiconductor packages, may generate considerable heat during operation. To prevent overheating of such semiconductor packages, dedicated heat sinks may need to be provided. A semiconductor package of the SMD type (SMD - Surface Mount Device) can be mounted on an application board and dissipated via the application board. However, application boards can have considerable thermal resistance, which can negatively impact cooling efficiency. Improved semiconductor packages, improved semiconductor assemblies, and improved methods for making semiconductor packages may help address these and other problems. Contents of the invention [0003] Aspects relate to a semiconductor package including a chip carrier, a semiconductor chip attached to th...
Claims
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IPC IPC(8): H01L23/28H01L23/40H01L21/50
CPCH01L23/28H01L23/40H01L21/50H01L23/3121H01L23/34H01L23/4006H01L2023/405H01L23/3677H01L23/12H01L23/3107H01L21/4871
Inventor R·奥特伦巴李德森K·席斯X·施勒格尔王莉双M·H·祖尔基夫利
Owner INFINEON TECH AG