Pressure sensor, substrate structure and manufacturing method thereof

A pressure sensor and substrate technology, which is applied to the substrate structure and its manufacture, and the field of pressure sensors, can solve the problems of easy freezing of the pressure chip structure and other problems.

Pending Publication Date: 2021-01-22
WUHAN FINEMEMS
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  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0003] The purpose of the embodiments of the present invention is to provide a pressure sensor, a substrate structure and a manufacturing method thereof, aiming at solving the problem that the pressure chip structure is easy to freeze in a low temperature environment

Method used

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  • Pressure sensor, substrate structure and manufacturing method thereof
  • Pressure sensor, substrate structure and manufacturing method thereof
  • Pressure sensor, substrate structure and manufacturing method thereof

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Embodiment Construction

[0032] The following will clearly and completely describe the technical solutions in the embodiments of the present invention with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of them. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without creative efforts fall within the protection scope of the present invention.

[0033] It should be noted that if there is a directional indication (such as up, down, left, right, front, back...) in the embodiment of the present invention, the directional indication is only used to explain the position in a certain posture (as shown in the accompanying drawing). If the specific posture changes, the directional indication will also change accordingly.

[0034] In addition, if there are descriptions involving "first", "second" and ...

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Abstract

The invention provides a pressure sensor, a substrate structure and a manufacturing method thereof. The substrate structure for the pressure sensor comprises a substrate, a pressure hole is formed inthe substrate in a penetrating mode, the pressure hole comprises a straight hole and a taper hole which are arranged in the first direction, the taper hole is formed by extending from the hole edge ofthe straight hole, and the hole diameter of the taper hole is gradually widened in the first direction.

Description

technical field [0001] Embodiments of the present invention relate to the technical field of pressure sensors, and in particular to a pressure sensor, a substrate structure and a manufacturing method thereof. Background technique [0002] The core of the pressure sensor includes a substrate and a chip mounted on the substrate. A pressure hole is formed through the substrate. The chip is bonded and covers the pressure hole. However, when the gas pressure is detected in a humid environment, the gas From the pressure hole into contact with the sensing element of the chip, the steam in the gas condenses into water at low temperature, and it is easy to accumulate and freeze in the pressure hole. Contents of the invention [0003] The purpose of the embodiments of the present invention is to provide a pressure sensor, a substrate structure and a manufacturing method thereof, aiming at solving the problem that the pressure chip structure is easy to freeze in a low temperature env...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B81B7/00B81C1/00G01L19/06
CPCB81B7/0035B81B2201/0264B81C1/00087G01L19/0654
Inventor 王小平曹万杨军洪鹏
Owner WUHAN FINEMEMS
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