Deposition system with multi-cathode

Abstract

A deposition system, and a method of operation thereof are disclosed. The deposition system comprises a cathode assembly comprising a rotating magnet assembly including a plurality of outer peripheralmagnets surrounding an inner peripheral magnet.

Description

technical field [0001] The present disclosure relates generally to substrate processing systems and, more particularly, to deposition systems having multiple cathode assemblies (multi-cathode). Background technique [0002] Sputtering, otherwise known as physical vapor deposition (PVD), has been used to deposit metals and related materials in the fabrication of semiconductor integrated circuits. The use of sputtering has expanded to deposit metal layers onto the sidewalls of high aspect ratio holes, such as vias or other vertical interconnect structures, and to fabricate extreme ultraviolet (EUV) mask blanks. In the manufacture of EUV mask blanks, it is desirable to minimize particle generation, since particles can negatively affect the properties of the final product. [0003] Plasma sputtering can be accomplished using DC sputtering or RF sputtering. Plasma sputtering typically includes a magnetron located on the back of the sputtering target, which contains two magnets ...

AI Technical Summary

Problems solved by technology

Regardless of the target shape, at a particular location relative to the magnetic field of the magnetron's magnet, the target is more preferentially eroded, resulting in an inhomogeneous or asymmetric erosion distribution

Non-uniform erosion distribution of the target can lead to poor uniformity of the deposited film and non-uniform film properties on the substrate

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