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Alignment mechanism and alignment method of bonding machine table

A bonding machine and alignment mechanism technology, which is applied in the fields of electrical components, semiconductor/solid-state device manufacturing, circuits, etc., can solve problems such as poor accuracy, low alignment efficiency, process efficiency and yield impact, etc. Achieve the effect of improving accuracy and efficiency and saving costs

Inactive Publication Date: 2021-02-02
鑫天虹(厦门)科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] Although the bonding of the wafer and the carrier substrate can be completed through the above steps, the alignment mechanism of the general bonding machine still has poor accuracy and alignment. The problem of low precision efficiency has a certain impact on the efficiency and yield of the process

Method used

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  • Alignment mechanism and alignment method of bonding machine table
  • Alignment mechanism and alignment method of bonding machine table
  • Alignment mechanism and alignment method of bonding machine table

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Embodiment Construction

[0028] see figure 1 and figure 2 , are a three-dimensional schematic diagram and a cross-sectional schematic diagram of an embodiment of the alignment mechanism of the bonding machine according to the present invention, respectively. As shown in the figure, the alignment mechanism 10 of the bonding machine mainly includes a stage 11 , at least three first alignment pins 131 , at least three second alignment pins 133 , a first cam 151 and a second The cam 153, wherein the first alignment pin 131 and the second alignment pin 133 are arranged in the area of ​​the carrier 11 near the edge or periphery, for example, a placement area 113 can be defined on a carrier surface 111 of the carrier 11, and the first The alignment pins 131 and the second alignment pins 133 are arranged in a spaced manner, such as figure 1 The components shown with hatching are the second alignment pins 133 and are disposed around the perimeter of the placement area 113 .

[0029] The carrying surface 11...

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Abstract

The invention provides an alignment mechanism of a bonding machine table, and particularly relates to an alignment mechanism of a wafer bonding machine table, which mainly comprises a carrying table,at least three first alignment pins, at least three second alignment pins, a first cam and a second cam. When the first cam rotates relative to the carrying table, the first cam drives the first alignment pins to move relative to the carrying table so as to position a first substrate on the carrying table. When the second cam rotates relative to the carrying table, the second cam drives the secondalignment pins to move relative to the carrying table so as to position a second substrate on the first substrate, so that the second substrate is aligned with the first substrate, and the bonding and overlapping of the first substrate and the second substrate are facilitated.

Description

technical field [0001] The present invention relates to an alignment mechanism and an alignment method of a bonding machine, in particular to an alignment mechanism and an alignment method of a wafer bonding machine, which can quickly and accurately align wafers and substrates. In order to facilitate the subsequent bonding of wafers and substrates. Background technique [0002] With the advancement of semiconductor technology, the thickness of wafers has been continuously reduced to facilitate subsequent wafer dicing and packaging processes. In addition, the thinning of the wafer is also beneficial to the advantages of reducing the size of the chip, reducing the resistance, speeding up the operation speed and prolonging the service life. However, the structure of the thinned wafer is very fragile, and the wafer is prone to warpage or breakage in the subsequent process, thereby reducing the yield of the product. [0003] In order to avoid the above-mentioned problems, gener...

Claims

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Application Information

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IPC IPC(8): H01L21/68H01L21/67
CPCH01L21/68H01L21/67132
Inventor 林俊成张容华张茂展
Owner 鑫天虹(厦门)科技有限公司
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