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Semiconductor structure and defect detection method thereof

A defect detection and semiconductor technology, applied in the fields of semiconductor devices, semiconductor/solid-state device testing/measurement, semiconductor/solid-state device components, etc., can solve problems such as serious impact on the quality of integrated circuits, optimize defect detection sensitivity, improve The effect of the ability to detect and locate defects

Active Publication Date: 2021-02-02
UNITED SEMICONDUCTOR (XIAMEN) CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

At the same time, the impact of these tiny defects or particles on the quality of integrated circuits is becoming more and more serious

Method used

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  • Semiconductor structure and defect detection method thereof
  • Semiconductor structure and defect detection method thereof
  • Semiconductor structure and defect detection method thereof

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Embodiment Construction

[0035] In order to enable those who are familiar with the technical field of the present invention to further understand the present invention, several preferred embodiments of the present invention are enumerated below, and in conjunction with the accompanying drawings, the constitutional content and intended achievement of the present invention are explained in detail. effect.

[0036] Please refer to Figure 1 to Figure 2 , which is a schematic diagram of the defect detection method in the first preferred embodiment of the present invention. First, please refer to figure 1 As shown, a wafer (wafer) 100 includes a plurality of active die regions (active die regions) 101, which are distinguished by a plurality of scribe lines 103, and each active die region 101 can be fabricated in subsequent cutting In the process, it is cut into a plurality of dies (not shown) and then can be manufactured into chips (chips, not shown) through the packaging process and the like. Wherein, ...

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Abstract

The invention discloses a semiconductor structure and a defect detection method thereof. The semiconductor structure comprises a chip, a plurality of first patterns and at least three openings. The first patterns are arranged on the chip and are arranged in parallel along a first direction at intervals. The openings are formed in the first patterns so as to cut off the first patterns, the openingshave equal-proportion increasing sizes in the first direction, and the openings are sequentially arranged according to the equal-proportion sizes. In another embodiment, the semiconductor structure additionally comprises at least three bridge structures disposed between the first patterns to connect any two adjacent first patterns.

Description

technical field [0001] The invention relates to a semiconductor structure and a defect detection method, in particular to a small-sized semiconductor structure and a defect detection method thereof. Background technique [0002] In the semiconductor manufacturing process, small particles or defects are often generated due to some unavoidable reasons. With the continuous reduction of component size and the continuous improvement of circuit integration in the semiconductor manufacturing process, the probability of occurrence of defects also increases. . At the same time, the impact of these tiny defects or particles on the quality of integrated circuits is becoming more and more serious. Therefore, while performing various semiconductor manufacturing processes, it is also necessary to conduct defect detection for the formed semiconductor structure, and then analyze the causes of the defects according to the detection results, and avoid or reduce defects by adjusting the manuf...

Claims

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Application Information

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IPC IPC(8): H01L23/544H01L21/66
CPCH01L22/30H01L22/12
Inventor 蔡清彦黄凯斌谈文毅
Owner UNITED SEMICONDUCTOR (XIAMEN) CO LTD