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Vacuum treatment device

A technology of vacuum processing device and vacuum chamber, which is applied in vacuum evaporation plating, ion implantation plating, coating and other directions, can solve the problem of inability to continuously metallize small polyhedral bulk devices.

Pending Publication Date: 2021-02-05
RICHVIEW ELECTRONICS CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

However, the existing metallization vacuum treatment devices are all aimed at continuous metallization of film-like insulating substrates arranged in roll-to-roll, or sheet-like / plate-like insulating 10,000) small polyhedral bulk devices for continuous metallization

Method used

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Examples

Experimental program
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Effect test

Embodiment 1

[0101] figure 2 A schematic diagram of the vacuum processing apparatus according to the first embodiment is shown. In this embodiment, the vacuum chamber C of the vacuum processing device 1 is a polyhedral single-chamber structure, which is a hexahedron structure as shown in the figure. The vacuum chamber C can be made of materials such as 304 stainless steel or 6061 aluminum that will not affect the small polyhedral devices through welding and other processes. As shown in the figure, the feeding system 10, the Hall source processing module 21, the ion implantation module 22, the multi-arc ion plating deposition module, the magnetron sputtering module 24 and the feeding system 50 of the vacuum processing device 1 are distributed in the circumferential direction. Around the main cavity, wherein the multi-arc ion plating deposition module includes a first multi-arc ion plating device 231 and a second multi-arc ion plating device 232, to successively form a first metal primer l...

Embodiment 2

[0104] image 3 A schematic diagram of a vacuum processing apparatus according to a second embodiment is shown. In this embodiment, the vacuum chamber C of the vacuum processing device 1 is a linear polyhedron structure, that is, a structure obtained by connecting multiple chambers fixedly to each other along the horizontal direction. The vacuum chamber C can be made of materials such as 304 stainless steel or 6061 aluminum that will not affect the small polyhedral devices, and is made by welding and other processes, and the multiple chambers are connected and fixed by screws and sealing rings. As shown in the figure, the feeding system 10, the Hall source processing module 21, the ion implantation module 22, the multi-arc ion plating deposition module, the magnetron sputtering module 24 and the feeding system 50 of the vacuum processing device 1 are distributed along the linear direction. In a plurality of cavities connected to each other, wherein the multi-arc ion plating d...

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Abstract

The invention relates to a vacuum treatment device (1). The vacuum treatment device (1) comprises a feeding system (10), an ion source system (20), a power supply system (30), a moving system (40) anda discharging system (50), wherein the feeding system (10) is configured to feed a base material (100) into the vacuum treatment device (1); the ion source system (20) is arranged in a vacuum cavity(C), comprises a pretreatment module, an ion implantation module (22), a multi-arc ion plating deposition module (23) and a magnetron sputtering module (24), and is used for treating the base material(100); the power supply system (30) is used for supplying power to each module in the ion source system (20); the moving system (40) is configured to move the base material (100) to pass through eachmodule in the ion source system (20); and the discharging system (50) is configured to take out the processed base material (100) from the vacuum treatment device (1). The vacuum treatment device hasthe characteristics of high efficiency, automation and low cost, and can realize continuous metallization of a large number of small polyhedral blocky devices.

Description

technical field [0001] The invention relates to a vacuum processing device, especially a vacuum processing device suitable for the metallization of small polyhedral devices, wherein the small polyhedral devices can be used to manufacture various microwave devices, such as various small microwave devices based on polymer resin or dielectric ceramics . Background technique [0002] Microwave devices refer to devices that work in the microwave band (that is, the frequency is 300MHz~300GHz), and are widely used in transmitters, receivers, antenna systems, displays, radars, communication systems, and the like. Microwave devices include an insulating substrate and a metal layer on the substrate. According to design requirements, special structures such as blind holes, grooves, through holes or through grooves can be formed. The surface of the insulating substrate and the special hole and groove structure need to be metallized to form a metal layer in order to realize the function...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C23C14/48C23C14/32C23C14/35C23C14/56
CPCC23C14/48C23C14/325C23C14/35C23C14/568Y02P70/50
Inventor 郭久林张志强杨志刚
Owner RICHVIEW ELECTRONICS CO LTD
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