Vacuum treatment device
A technology of vacuum processing device and vacuum chamber, which is applied in vacuum evaporation plating, ion implantation plating, coating and other directions, can solve the problem of inability to continuously metallize small polyhedral bulk devices.
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Embodiment 1
[0101] figure 2 A schematic diagram of the vacuum processing apparatus according to the first embodiment is shown. In this embodiment, the vacuum chamber C of the vacuum processing device 1 is a polyhedral single-chamber structure, which is a hexahedron structure as shown in the figure. The vacuum chamber C can be made of materials such as 304 stainless steel or 6061 aluminum that will not affect the small polyhedral devices through welding and other processes. As shown in the figure, the feeding system 10, the Hall source processing module 21, the ion implantation module 22, the multi-arc ion plating deposition module, the magnetron sputtering module 24 and the feeding system 50 of the vacuum processing device 1 are distributed in the circumferential direction. Around the main cavity, wherein the multi-arc ion plating deposition module includes a first multi-arc ion plating device 231 and a second multi-arc ion plating device 232, to successively form a first metal primer l...
Embodiment 2
[0104] image 3 A schematic diagram of a vacuum processing apparatus according to a second embodiment is shown. In this embodiment, the vacuum chamber C of the vacuum processing device 1 is a linear polyhedron structure, that is, a structure obtained by connecting multiple chambers fixedly to each other along the horizontal direction. The vacuum chamber C can be made of materials such as 304 stainless steel or 6061 aluminum that will not affect the small polyhedral devices, and is made by welding and other processes, and the multiple chambers are connected and fixed by screws and sealing rings. As shown in the figure, the feeding system 10, the Hall source processing module 21, the ion implantation module 22, the multi-arc ion plating deposition module, the magnetron sputtering module 24 and the feeding system 50 of the vacuum processing device 1 are distributed along the linear direction. In a plurality of cavities connected to each other, wherein the multi-arc ion plating d...
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Abstract
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