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Device binding method, apparatus and equipment

A device, binding technology, used in instrumentation, nonlinear optics, optics, etc.

Active Publication Date: 2021-02-09
合肥欣奕华智能机器股份有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] The present invention provides a method, device and equipment for device binding, which solves the problem of determining the positional relationship between parts and groups of binding devices to achieve precise binding

Method used

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  • Device binding method, apparatus and equipment
  • Device binding method, apparatus and equipment
  • Device binding method, apparatus and equipment

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0127] Such as figure 1 As shown, the embodiment of the present invention provides an application scenario for device binding. The above application scenario is only an example of an application scenario for device binding, and is not limited. In specific implementation, it can be used in the above application Add or delete some components in the scene, including:

[0128] The first workbench 101 is used to carry the substrate, and the first origin of the marking pattern is fixed on the first workbench.

[0129] The first origin 102 is fixed on the above-mentioned first workbench, and is used to determine the origin of the equipment.

[0130] The first movement group 103 is integrated with the binding head and the camera and has a fixed relative positional relationship, which can move in the X and Y directions and drive the binding head and the camera to move.

[0131] The binding head 104 has a fixed relative position relationship with the above-mentioned first movement gro...

Embodiment approach 1

[0209] Embodiment 1: Obtain the deviation of all bound devices relative to the camera by taking pictures with the camera and record the axis coordinates of the second motion group to calibrate the relationship between the device coordinates of the bound devices and the device coordinates of the second origin.

[0210] Move the first movement group and the second movement group so that the camera is basically above the second movement group, and control the camera to move in the vertical direction to ensure that the camera can clearly see the second workbench;

[0211] Move the second motion group so that the center of the camera's field of view coincides with the center of the second origin, and record the axis coordinates of the second motion group at this time as (X2_d0, Y2_d0);

[0212] Move the second movement group in turn, so that the bound device on the second workbench appears in the center of the camera's field of view, and the camera takes pictures to obtain the devia...

Embodiment approach 2

[0218] Embodiment 2: Obtain the deviation of all bound devices relative to the camera by taking pictures with the camera and record the axis coordinates of the second motion group to calibrate the relationship between the device coordinates of the bound devices and the device coordinates of the second origin.

[0219] Move the first movement group and the second movement group so that the camera is basically above the second movement group, and control the camera to move in the vertical direction to ensure that the camera can clearly see the second workbench;

[0220] Move the second motion group so that the center of the camera's field of view coincides with the center of the second origin, and record the axis coordinates of the first motion group at this time as (X1_d0, Y1_d0);

[0221] Move the first movement group in turn, so that the bound device on the second workbench appears in the center of the camera's field of view, and the camera takes pictures to obtain the deviati...

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Abstract

The invention provides a device binding method, apparatus and equipment. The method comprises the steps of determining a first axis coordinate of a first motion group when a camera is aligned with a binding target; determining the target equipment coordinate of the binding target in a corresponding coordinate system; determining a corresponding second axis coordinate when a binding head is moved to be aligned with the binding target according to the first axis coordinate and a pre-calibrated coordinate relationship between the binding head and the camera; determining a third axis coordinate ofa second motion group when a bound device moves to the target equipment coordinate according to a pre-calibrated relationship between the equipment coordinate of the bound device and the axis coordinate of the second motion group; and when the first motion group and the second motion group are moved to the second axis coordinate and the third axis coordinate respectively, controlling the bindinghead to bind the bound device and the binding target. According to the method, the relationship between the groups of the binding equipment is calibrated in advance, so that the binding head and the to-be-bound device can be precisely controlled, the binding head and the to-be-bound device are aligned with the binding target, and precise binding is realized.

Description

technical field [0001] The present invention relates to the field of display technology, in particular to a method, device and equipment for device binding. Background technique [0002] In the manufacturing process of the display device, for example, in the manufacturing process of the array substrate of the liquid crystal display, devices such as chips need to be bound to the substrate to drive the image display of the display panel. The bonding of chips and other devices is done on the bonding device, and the bonding accuracy of the bonding device is directly related to the bonding efficiency and bonding quality of chips and other devices. An existing binding device includes a binding head, which can move relatively in the horizontal and vertical directions of the substrate, and the binding head binds the device to be bound by pressing down in the vertical direction to the display device. If the binding head deviates from the expected binding position when the binding h...

Claims

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Application Information

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IPC IPC(8): G02F1/13
CPCG02F1/1303
Inventor 王广炎冯晓庆吕海波
Owner 合肥欣奕华智能机器股份有限公司
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