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Head-mounted device

A head-mounted device and camera technology, applied in the field of human-computer interaction, can solve the problems of difficult assembly of flexible circuit boards, large space required for eyeglass frames, and difficult disassembly, etc., to save structural stacking space, simple structure, and easy assembly Effect

Active Publication Date: 2021-02-12
GUANGDONG OPPO MOBILE TELECOMM CORP LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0002]In the existing AR (Augmented Reality, Augmented Reality) glasses and other wearable devices, the connection between the Type-C interface and the main board is mainly through the small inside of the temple. Board transfer, and then transfer to the main board after passing through the temples, rotating shafts, and spectacle frames. This type of product requires a large space on both sides of the spectacle frame, and it is difficult to assemble and disassemble the flexible circuit board.

Method used

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Embodiment Construction

[0037] The technical solutions in the embodiments of the present application will be clearly and completely described below in conjunction with the drawings in the embodiments of the present application. Apparently, the described embodiments are only some of the embodiments of this application, not all of them. Based on the embodiments in this application, all other embodiments obtained by those skilled in the art without making creative efforts belong to the protection scope of this application.

[0038] see figure 1 and figure 2 , figure 1 It is a schematic structural diagram of the head-mounted device provided in the embodiment of the present application, figure 2 It is a schematic diagram of explosive decomposition of the head-mounted device provided in the embodiment of the present application. In this embodiment, the head-mounted device 1 may include a housing assembly 10, a support assembly 20 connected to two opposite ends of the housing assembly 10, a host 30 ac...

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Abstract

The embodiment of the invention provides a head-mounted device. The head-mounted device includes a shell assembly, a mainboard and a glasses leg assembly; the mainboard is accommodated in the shell assembly; the glasses leg assembly comprises a glasses leg shell and a flexible circuit board; the front end of the glasses leg shell is connected with one side part of the shell assembly; the flexiblecircuit board comprises a front part and a rear part, the front part is located outside the glasses leg shell and extends on the outer side face of the shell assembly, the front end of the front partis electrically connected with the mainboard through a connector, and the rear part is fixedly mounted in the glasses leg shell. The flexible circuit board of the head-mounted device provided by the embodiment of the invention is directly connected to the mainboard from the interface, a small adapter plate is omitted, the structure is simple, the flexible circuit board is convenient to assemble, the flexible circuit board occupies little space on the two sides of a glasses frame, a heat dissipation air duct on the inner side of the glasses frame can be avoided, and the heat dissipation air duct is not affected by the flexible circuit board completely.

Description

technical field [0001] The present application relates to the technical field of human-computer interaction, and in particular to a head-mounted device. Background technique [0002] For existing AR (Augmented Reality, Augmented Reality) glasses and other wearable devices, the connection between the Type-C interface and the motherboard is mainly through the small board inside the temple, and then through the temple, the shaft, and the frame. Connected to the main board, this type of product requires a lot of space on both sides of the spectacle frame, and the flexible circuit board is difficult to assemble and disassemble. Contents of the invention [0003] An embodiment of the present application provides a head-mounted device, which improves the wearability of the head-mounted device and facilitates assembly of a flexible circuit board. [0004] An embodiment of the present application provides a head-mounted device, including: [0005] shell components; [0006] a mo...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G02B27/01
CPCG02B27/0176G02B2027/0178
Inventor 王云鹏周伟蔡洪侦
Owner GUANGDONG OPPO MOBILE TELECOMM CORP LTD