Mass transfer method and device for micro LED devices

A technology of LED device and transfer method, which is applied to the manufacturing of electric solid-state devices, semiconductor devices, semiconductor/solid-state devices, etc., can solve the problems of poor transfer effect, stress damage, and difficulty, so as to achieve good transfer effect and reduce stress damage. , to avoid the effect of shattering

Pending Publication Date: 2021-02-12
INST OF FLEXIBLE ELECTRONICS TECH OF THU ZHEJIANG
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  • Abstract
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  • Claims
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Problems solved by technology

[0006] The embodiment of the present application provides a method and device for mass transfer of micro-LED devices, to at least solve the problem of stress damage in the process of transferring from the carrier substrate to the receiving substrate in the traditional mass transfer method in the related art, and the micro-LED devices are relatively small. Fragile, easily shattered, transfers poorly, difficult issues

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  • Mass transfer method and device for micro LED devices
  • Mass transfer method and device for micro LED devices
  • Mass transfer method and device for micro LED devices

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Embodiment Construction

[0037] In order to make the purpose, technical solutions and advantages of the present application clearer, the present application will be described and illustrated below in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described here are only used to explain the present application, and are not intended to limit the present application. Based on the embodiments provided in the present application, all other embodiments obtained by persons of ordinary skill in the art without creative efforts shall fall within the protection scope of the present application.

[0038] Obviously, the accompanying drawings in the following description are only some examples or embodiments of the present application, and those skilled in the art can also apply the present application to other similar scenarios. In addition, it can also be understood that although such development efforts may be complex and lengthy, for those of ...

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Abstract

The invention relates to a mass transfer method and device for micro LED devices. The mass transfer method method for the micro LED devices comprises the steps of adhering a plurality of micro LED devices to a carrier substrate; abutting the plurality of micro LED devices on the carrier substrate against the face, which is coated with a second viscosity variable material, of the buffer substrate,and adjusting the viscosity of part of the area of the first viscosity variable material so as to enable the micro LED devices on the carrier substrate to be adhered to the buffer substrate; and transferring the micro LED devices on the buffer substrate to a receiving substrate according to preset positions. According to the mass transfer method and device for the micro LED devices, the carrier substrate, the buffer substrate and the receiving substrate are provided, the second viscosity variable material is used for efficiently and selectively transferring the micro LEDs in batches, stress damage generated in the transfer process is absorbed through the buffer substrate, stress loss generated by attachment is reduced, the micro LED devices are prevented from being broken in mass transfer,the transfer difficulty is reduced, and the transfer effect is good.

Description

technical field [0001] The present application relates to the field of display technology, in particular to a method and device for mass transfer of micro-LED devices. Background technique [0002] Micro LED device technology refers to a small-sized LED array integrated on a substrate with high density. Currently, micro LED device technology is under development, and the industry expects high-quality micro LED device products to enter the market. High-quality micro-LED devices will have a profound impact on traditional display products (such as LCD / OLED) that have been put on the market. [0003] In the process of manufacturing micro LED devices, an array of micro LED devices is first formed on a carrier substrate. The carrier substrate can be an attachment substrate or an intermediate substrate, and then, the array of micro LED devices is transferred to a receiving substrate of a display device, which can be a display screen or a display panel, etc., and the display devic...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L21/683H01L33/48
CPCH01L21/6835H01L33/48H01L2221/68368H01L2933/0033
Inventor 陈来成刘卫梦华聪聪徐剑峰
Owner INST OF FLEXIBLE ELECTRONICS TECH OF THU ZHEJIANG
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