A kind of basketless wafer cleaning method
A wafer and basket crystal technology, applied in the field of wafer cleaning equipment, can solve problems such as affecting the cleaning effect and blocking water flow, and achieve the effect of ensuring the cleaning effect
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Embodiment 1
[0058] This embodiment provides a basketless wafer cleaning device, such as figure 1 shown, including:
[0059] Horizontal conveying slide 1;
[0060] The basketless wafer grabbing manipulator 3 is used to grab the wafer 9 and drive the wafer 9 up and down under the action of the lifting mechanism 2;
[0061] The first cleaning tank 4, the second cleaning tank 5 and the third cleaning tank 6 arranged horizontally side by side;
[0062] The basketless wafer grabbing manipulator 3 is arranged on the horizontal transport slide 1, and can reach above any one of the first cleaning tank 4, the second cleaning tank 5 and the third cleaning tank 6;
[0063] The first cleaning tank 4, the second cleaning tank 5 and the third cleaning tank 6 all have a tank body 51 capable of accommodating wafers, and the top of the tank body 51 is provided with a first nozzle 53, and the tank body The bottom of 51 is provided with a wafer support frame 54;
[0064] The cleaning solution or clear wa...
Embodiment 2
[0088] This embodiment provides a method for cleaning a basket-free wafer, using the device of Embodiment 1, comprising the following steps:
[0089] S1: Grab the wafer 9 by the basketless wafer grasping manipulator 3 and drive the wafer 9 down into the tank body 51 of the cleaning tank;
[0090] S2: placing the wafer 9 on the wafer support frame 54 provided at the bottom inside the tank 51, and removing the basketless wafer grabbing robot 3;
[0091] S3: Open the first nozzle 53 provided on the top of the tank 51, so that the cleaning liquid or clear water sprayed from the nozzle on the first nozzle 53 is sprayed onto the peripheral surface of the wafer in the form of a parabola, and the water flow is absorbed by the wafer. Cut and flow to the front and back surfaces of the wafer;
[0092] S3A: After the first nozzle 53 stops spraying water, the cleaning liquid or clear water sprayed from the second nozzle 52 provided at the bottom of the first cleaning tank 4 is sprayed ont...
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