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Chip taking and placing jig for chip uncoiling operation

A technology of chips and jigs, which is applied in the field of chip pick-and-place jigs, can solve the problems of low operating efficiency and time-consuming, and achieve the effect of simple structure, easy implementation, and improved unwinding efficiency

Inactive Publication Date: 2021-02-26
广东利扬芯片测试股份有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

This method is inefficient, and it is often difficult to accurately place the semiconductor chip in the chip groove of the tray at one time. If the chip is placed crookedly, the operator needs to manually align the chip again, which takes a lot of time.

Method used

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  • Chip taking and placing jig for chip uncoiling operation
  • Chip taking and placing jig for chip uncoiling operation
  • Chip taking and placing jig for chip uncoiling operation

Examples

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Embodiment Construction

[0028] In order to describe the content, structural features, achieved goals and effects of the present invention in detail, the following will be described in detail in combination with the embodiments and accompanying drawings.

[0029] In describing the present invention, it should be understood that the terms "front", "rear", "upper", "lower", "first direction", "second direction", "lateral direction" and the like indicate orientation or position The relationship is based on the orientation or positional relationship shown in the drawings, which is only for the convenience of describing the present invention and simplifying the description, and thus should not be construed as limiting the protection content of the present invention.

[0030] see Figure 1 to Figure 12 , the present invention discloses a chip pick-and-place jig 100 for chip unwinding operations, which is suitable for picking up multiple chips 220 on a carrier tape 210 and accurately placing them into chip g...

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PUM

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Abstract

The invention discloses a chip taking and placing jig for chip uncoiling operation. The chip taking and placing jig comprises a base body, a plurality of suction nozzles, a driving piece and a plurality of adjusting pieces, wherein the suction nozzles are arranged on the base body side by side, each suction nozzle is provided with a gas channel, the base body is provided with a vacuum channel, thegas channels of the suction nozzles respectively communicate with the vacuum channel through a connecting pipeline, and the vacuum channel is used for being connected with a vacuum device so that thesuction nozzles can suck up chips. The output end of the driving piece is connected with the suction nozzle located at the end, and the driving piece is used for driving the suction nozzle to move inthe first direction so as to push the other suction nozzles to enable the multiple suction nozzles to be close to one another. When the suction nozzle at the end part moves towards a second direction, the adjusting pieces enable the suction nozzles to be far away from each other so as to adapt to different spacing requirements when the chips are sucked up and put down. According to the chip taking and placing jig, a plurality of chips on a carrier tape can be sucked up at one time and accurately placed in chip grooves of a tray, so that the chip uncoiling efficiency is improved, and an operator does not need to straighten the chips again.

Description

technical field [0001] The invention relates to the technical field of semiconductors, in particular to a chip pick-and-place jig used for chip unwinding operations. Background technique [0002] One way of shipping semiconductor chips is to ship them in tape and reel packaging, and the tape includes a carrier tape for carrying the semiconductor chips and a transparent cover tape covering the semiconductor chips. If the semiconductor chips need to be unrolled and repacked before shipment (if there is a product problem), the operator manually tears off the transparent cover tape on the tape, and then picks up the semiconductor chips one by one and puts them in the to the tray for repackaging. This method is inefficient, and it is often difficult to accurately place the semiconductor chip in the chip groove of the tray at one time. If the chip is placed crookedly, the operator needs to manually align the chip again, which takes a lot of time. Contents of the invention [0...

Claims

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Application Information

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IPC IPC(8): B65B35/38B65B35/56B65B69/00
CPCB65B35/38B65B35/56B65B69/0025
Inventor 李恊松郑朝生朱军柏永生杨雅鄢郑广源袁俊卢旭坤张亦锋辜诗涛
Owner 广东利扬芯片测试股份有限公司
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