Electroplating clamp and chuck for printed circuit board

Abstract

The embodiment of the invention relates to the technical field of integrated circuits, in particular to an electroplating clamp and a chuck for a printed circuit board. The chuck of the electroplatingclamp for the printed circuit board comprises electroplating clamping points and suckers, the suckers are arranged at two ends of the chuck, and the electroplating clamping points are arranged in thesuckers. The suckers are arranged at the clamping points positions, the electroplating clamp clamps a PCB, before the electroplating clamp enters electroplating liquid, the suckers are adsorbed to the surface of the PCB, so that the clamping points positions form vacuum, the clamping points cannot make contact with the electroplating liquid after the electroplating clamp enters a bath solution, all conductive parts on the clamp cannot make direct contact with the electroplating liquid and do not make contact with the electroplating liquid in the electroplating process, and electroplating is completed, therefore, no copper exists on the clamp, deplating is not needed, the cost is saved, and the clamp is relatively environment-friendly.

Description

technical field [0001] Embodiments of the present invention relate to the technical field of integrated circuits, and in particular, relate to an electroplating jig and chuck for printed circuit boards. Background technique [0002] The PCB (printed circuit board, printed circuit board) boards used in the electronics industry need to be electroplated. Electroplating metallizes the holes in the board to achieve the purpose of conduction. During the electroplating process, the board needs to be fixed on the electroplating fixture. The electroplating fixture conducts electricity, and the part of the electroplating fixture clamping the board will be immersed in the electroplating solution, so that the electroplating fixture is also electroplated with copper. If the copper on the electroplating fixture is not removed, it will cause quality problems in the subsequent electroplating PCB. The existing electroplating Fixtures must be deplated. Generally, nitric acid or sulfuric acid / ...

AI Technical Summary

Problems solved by technology

[0002] The PCB (printed circuit board, printed circuit board) boards used in the electronics industry need to be electroplated. Electroplating metallizes the holes in the board to achieve the purpose of conduction. During the electroplating process, the board needs to be fixed on the electroplating fixture. The electroplating fixture conducts electricity, and the part of the electroplating fixture clamping the board will be immersed in the electroplating solution, so that the electroplating fixture is also electroplated with copper. If the copper on the electroplating fixture is not removed, it will cause quality problems in the subsequent electroplating PCB. The existing electroplating Fixtures must be deplated. Generally, nitric acid or sulfuric acid / hydrogen peroxide is used to bite off the copper on the fixture. Add 4-5 sets of plating tanks to the plating line to remove the copper on the plating clips. The waste of production capacity and the potion of deplating will cause polluted environment

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