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Wafer processing system and wafer electroplating method

A technology for processing systems and wafers, which is applied to circuits, electrolytic components, electrical components, etc., and can solve problems such as the time-consuming wafer plating process and the impact on the cleanliness of the factory environment.

Pending Publication Date: 2021-03-16
硅密芯镀(海宁)半导体技术有限公司
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  • Abstract
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  • Application Information

AI Technical Summary

Problems solved by technology

[0003] The technical problem to be solved by the present invention is to provide a wafer processing system and Wafer Plating Method

Method used

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  • Wafer processing system and wafer electroplating method
  • Wafer processing system and wafer electroplating method
  • Wafer processing system and wafer electroplating method

Examples

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Embodiment Construction

[0064] The present invention is further illustrated below by means of examples, but the present invention is not limited to the scope of the examples.

[0065] like figure 1 and figure 2 As shown, the present invention discloses a wafer processing system, which includes a processing tank 2 , a wafer clamp 1 for fixing a wafer, and a moving mechanism 3 connected with the wafer clamp 1 .

[0066] like figure 1 As shown, the wafer processing system is used for cleaning wafers. The wafer processing system includes a processing tank 2, which is provided with a cleaning nozzle 6, a drain 7 and a water inlet (not shown in the figure), the cleaning nozzle 6 is located at the bottom of the entire processing tank 2, and the cleaning nozzle 6 is connected to the outside. The water pipeline is connected to spray water to the wafer when it is turned on, so as to realize the purpose of cleaning the surface of the wafer. The drain 7 is located at the lower end of the treatment tank 2, a...

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Abstract

The invention discloses a wafer processing system and a wafer electroplating method. The wafer processing system comprises a processing tank and a cleaning nozzle, wherein the cleaning nozzle is arranged in the processing tank, the wafer processing system further comprises an air outlet, and the air outlet is arranged in the processing tank and located above the cleaning nozzle; and a moving mechanism, which is connected to the wafer and can drive a wafer to move in the processing groove in the vertical direction. According to the technical scheme, the cleaning nozzle is arranged in the processing tank and is used for spraying and cleaning the wafer in the processing tank. The air outlet is also located in the processing tank and arranged above the cleaning nozzle, the moving mechanism used for moving the wafer can adjust the position of the wafer in the vertical direction, the wafer sprayed by the cleaning nozzle is moved to the position close to the air outlet, the wafer blow-dryingprocess continues to be carried out in the same tank body, time is saved, and the environmental pollution caused by the transfer of the wafer between groove bodies is effectively avoided.

Description

technical field [0001] The invention relates to the field of integrated circuit manufacturing, in particular to a wafer processing system and a wafer electroplating method. Background technique [0002] The manufacturing process of integrated circuits is generally divided into dry process and wet process. In the wet process, the wafer electroplating process is a very important step. After the horizontal electroplating is completed, the wafers usually need to be soaked, cleaned, and dried. After the wafers are washed in the cleaning tank, they must be transferred. To dry in another process tank, the overall electroplating process takes a long time, and it is easy to affect the cleanliness of the factory environment during the wafer transfer process. Contents of the invention [0003] The technical problem to be solved by the present invention is to provide a wafer processing system and Wafer plating method. [0004] The present invention solves the above technical proble...

Claims

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Application Information

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IPC IPC(8): H01L21/67C25D5/48C25D7/12C25D17/00
CPCH01L21/67034H01L21/67051C25D7/12C25D17/00C25D5/48
Inventor 史蒂文·贺·汪金涛樊芸王铮
Owner 硅密芯镀(海宁)半导体技术有限公司
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