A method for processing printed circuit boards by combining mold embossing and curing processes
A technology of printed circuit board and curing process, which is applied in the direction of printed circuit, printed circuit manufacturing, and removal of conductive materials by chemical/electrolytic methods, which can solve the problems of large environmental pollution, unfavorable mass production, and low efficiency of copper electroplating process , to achieve the effects of low cost, broadened application range and simplified process
Active Publication Date: 2021-08-10
GUANGDONG UNIV OF TECH
View PDF5 Cites 0 Cited by
- Summary
- Abstract
- Description
- Claims
- Application Information
AI Technical Summary
Problems solved by technology
The copper electroplating process adopted in this method not only pollutes the environment more, but also has high cost and low efficiency, which is not conducive to its industrialized mass production.
Method used
the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View moreImage
Smart Image Click on the blue labels to locate them in the text.
Smart ImageViewing Examples
Examples
Experimental program
Comparison scheme
Effect test
Embodiment Construction
[0039] The technical solutions of the present invention will be further described below in conjunction with the accompanying drawings and through specific implementation methods.
[0040] Such as Figure 1-6 As shown, a method for processing printed circuit boards in combination with mold embossing and curing processes, is characterized in that it includes the following steps:
[0041] S1: process a mold with micron array grooves, preheat the mold with an electric heating plate, heat press thin copper foil after mold preheating, and form a thin copper foil with microgroove arrays;
[0042] S2: Lay out the liquid medium layer on the printed circuit board, place the uncured liquid medium layer in the vacuum chamber, and eliminate the internal residual gas;
[0043] S3: transfer the thin copper foil with the micro-groove array to the surface of the liquid medium layer using a transfer printing process, so that the liquid medium layer is quickly in close contact with the thin cop...
the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More PUM
Login to View More Abstract
The invention relates to a method for processing a printed circuit board in combination with mold embossing and curing processes, comprising S1: processing a mold with micron array grooves, preheating the mold with an electric heating plate, and hot-pressing thin copper foil after the mold is preheated to form a mold with micron array grooves. Thin copper foil of microgroove array; S2: lay out liquid medium layer on printed circuit board, put uncured liquid medium layer in vacuum chamber, eliminate internal residual gas; S3: use transfer printing process to have microgroove array The thin copper foil is transferred to the surface of the liquid medium layer; S4: the liquid medium layer on the surface of the printed circuit board is subjected to light or thermal curing treatment; S5: fixed-point etching removes the protruding surface of the solid medium layer The thin copper foil and the solid dielectric layer, and the remaining part of the thin copper foil remains to form a copper circuit; S6: process a solder resist layer on the surface of the printed circuit board. The invention realizes the high-efficiency and low-cost processing of the micron-scale array circuit board through the combination of the embossing process and the solidification process of the medium layer, and is more conducive to industrial production.
Description
technical field [0001] The invention relates to the technical field of printed circuit board integrated circuit packaging substrates, in particular to a method for processing printed circuit boards in combination with mold embossing and curing processes. Background technique [0002] With the continuous development of electronic products in the direction of miniaturization and intelligence, higher requirements are put forward for the corresponding integrated circuits. As the provider of electrical connection of electronic components in integrated circuits, printed circuit boards have become increasingly prominent in the efficient and low-cost manufacture of fine circuits. The prior art CN201810567355.7 discloses a method for processing printed circuit boards by combining the embossing process and the electroplating process. The method first uses the embossing process to make grooves in the uncured liquid medium layer, then solidifies, and then passes through the surface Pla...
Claims
the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More Application Information
Patent Timeline
Login to View More Patent Type & Authority Patents(China)
IPC IPC(8): H05K3/06H05K3/10C25D3/38
CPCC25D3/38H05K3/064H05K3/068H05K3/107H05K2203/0392
Inventor 陈新陈云刘辉龙丁树权崔成强刘强
Owner GUANGDONG UNIV OF TECH