Circuit board chip frame transferring and assembling device and method thereof

Abstract

The invention belongs to the technical field of circuit board automatic production, and discloses a circuit board chip frame transferring and assembling device and method. The device comprises a chipframe transfer driving assembly and a chip frame clamping assembly; the chip frame transfer driving assembly is used for driving the chip frame clamping assembly to move and clamp, and assembling thechip frame on the circuit board; the chip frame clamping support plate is arranged on a moving part of the chip frame transfer driving assembly; the first chip frame clamping module and the second chip frame clamping module are arranged on the two sides of the chip frame clamping supporting plate respectively. The chip frame assembly clamping jaw has the advantages that the universality of the chip frame assembly clamping jaw is improved, the accuracy and stability of chip frame assembly clamping are improved, and the automatic assembly efficiency of a circuit board and a chip frame is improved.

Description

technical field [0001] The invention belongs to the technical field of circuit board automatic production, in particular to a circuit board chip frame transfer and assembly device and method thereof. Background technique [0002] In the circuit board production process, it is necessary to install chip frames on the circuit board to facilitate the subsequent installation of chips in their respective chip frames, so that the areas of each chip can be effectively divided and separated, so that each chip can work independently. [0003] Existing circuit board production equipment, such as the Chinese utility model patent application (publication number CN210469919U, announcement date: 20200505), discloses a PCB board assembly mechanism, including a feeding mechanism, a turning mechanism, a shaping mechanism and a feeding mechanism. The board is sent to the turning mechanism, which turns the PCB board over, and the feeding mechanism transports the PCB board from the turning mecha...

AI Technical Summary

Problems solved by technology

[0006] The object of the present invention is to solve the above-mentioned problem of low precision of the existing chip frame transfer and assembly, and to provide a circuit board chip frame transfer and assembly device. Mobile positioning accuracy; through the first chip frame clamping module and the second chip frame clamping module, two chip frames can be transferred and assembled at the same time to improve assembly efficiency, and the clamping firmness can be improved through the first chip frame clamping module

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