Electronic mainboard hot-pressing reinforcing and bonding device

Abstract

The invention discloses an electronic mainboard hot-pressing reinforcing and bonding device. The device comprises a box body, a transmission cavity is formed in the box body, and a shifting device used for pushing a machined workpiece out of the device is arranged in the transmission cavity. According to the electronic mainboard hot-pressing reinforcing and bonding device, a main sliding block isdriven to move downwards through screw transmission based on related knowledge of mechanical transmission, at the same time, a pressing element is driven to be separated from a pressure-sensitive element, and then a square shaft sleeve is shifted by an executing element to enable a part separating device to stop running, so that the part separating device stops running when the device is used formachining a hot-pressed electronic mainboard, and begins to run after the machining is completed, the integrated automatic device realizes automatic machining and workpiece separation, the machining efficiency is greatly improved, and machining accidents caused by misoperation of machining personnel are avoided.

Description

technical field [0001] The invention relates to the field of thermocompression bonding, in particular to a thermocompression reinforcement bonding device for an electronic motherboard. Background technique [0002] Hot pressing is the process of heating and pressing the paved and formed slab to form a fiber board with certain mechanical strength and water resistance. The traditional hot pressing device for the main board needs to spend a lot of time on the workpiece when processing the workpiece. It needs to be aligned with the device, and the proficiency of the operator is high, the processing cost is relatively high, and there is no return process after processing, it is very easy to cause processing accidents due to operator errors. [0003] The present invention illustrates a device capable of solving the above-mentioned problems. Contents of the invention [0004] Technical problem: The traditional motherboard hot-pressing device is heated on one side during processi...

AI Technical Summary

Problems solved by technology

[0004] Technical problem: The traditional motherboard hot-pressing device is heated on one side during processing, which leads to the situation that the processed workpiece will not be glued in place, and because there is no automatic correction device in some devices before processing, it is very easy to The offset of the workpiece occurs during processing, which leads to the scrapping of the workpiece, and most of the devices do not have the function of automatic return, which is prone to safety hazards for operators

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