Inverter mainboard etching equipment
An etching equipment and an inverter technology, applied in the field of inverter motherboard etching equipment, can solve problems such as difficult to avoid side erosion phenomenon, and achieve the effect of avoiding side erosion phenomenon
Active Publication Date: 2021-03-26
NANJING VOCATIONAL UNIV OF IND TECH
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Problems solved by technology
[0003] Therefore, it is necessary to reduce the occurrence of side erosion, and the current commonly used etching methods, whether it is intrusion etching or spray etching, are difficult to avoid the occurrence of side erosion
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[0028] In order to make the technical means, creative features, goals and effects achieved by the present invention easy to understand, the present invention will be further described below in conjunction with specific embodiments.
[0029] Such as Figure 1 to Figure 7 As shown, an inverter main board etching equipment includes a transfer mechanism 1, an etching mechanism 2 and a discharge assembly 3, the etching mechanism 2 is located directly below the transfer mechanism 1, the discharge assembly 3 etches the middle of the mechanism 2, and Mechanism 1 is provided with two opposite groups, the transfer mechanism 1 on the left rotates counterclockwise, and the transfer mechanism 1 on the right rotates clockwise;
[0030] The transfer mechanism 1 includes an outer crawler 101 and an inner crawler 102 rotatably connected between two outer plates 104, the inner crawler 102 is located inside the outer crawler 101, and the outer crawler 101 is divided into an outer cavity 112 and ...
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The invention discloses inverter mainboard etching equipment, and relates to the field of equipment mainboard etching processing, the inverter mainboard etching equipment comprises transfer mechanisms, etching mechanisms and discharging assemblies, the etching mechanisms are located under the transfer mechanisms, two opposite transfer mechanisms are arranged in the middle of the etching mechanismsof the discharging assemblies, and through arrangement of spraying from bottom to top, etching liquid is sprayed to the lower surface of a PCB for etching, and the etching liquid can directly drop down from the lower surface of the PCB without flowing through the side surface of the PCB; and air is continuously blown downwards above the PCB, and the PCB can block the air flow right above the PCB,so that the spraying of the etching liquid right below the PCB is not blocked, the air flow beside the PCB can blow away the etching liquid sprayed to the side surface of the PCB, and the side surface of the PCB is not in contact with the etching liquid, and the side etching phenomenon is avoided.
Description
technical field [0001] The invention relates to the field of equipment main board etching processing, in particular to an inverter main board etching equipment. Background technique [0002] The motherboards of various electrical equipment are composed of various basic components on the PCB, and most of the circuits in the PCB are etched, such as the inverter motherboard. Nowadays, with the development of electronic products, there are higher requirements for the accuracy of PCB boards. [0003] Therefore, it is necessary to reduce the occurrence of side erosion, and the current commonly used etching methods, whether it is intrusion etching or spray etching, cannot avoid the occurrence of side erosion. Among them, spray etching can greatly improve the side erosion phenomenon. [0004] There are two main reasons for the side erosion caused by spray etching. One is that when spraying, the etching solution will also be sprayed to the side of the PCB board. The second is that...
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IPC IPC(8): H05K3/06
CPCH05K3/06H05K3/068
Inventor 何智勇
Owner NANJING VOCATIONAL UNIV OF IND TECH