Multilayer structure with embedded sensing functionalities and related method of manufacture

Abstract

Integrated multilayer structure suitable for use in sensing applications is presented. The multilayer structure comprises at least one plastic layer (104), at least one film (102, 102B) layer providedon both sides of the plastic layer, said film layer (102) on a first side of the plastic layer comprising electronics (103, 110, 112, 114, 116, 305, 404, 405, 505, 06, 508, 510, 606, 606B, 608, 706,708, 1010, 1012) incorporating reactance sensing electronics for sensing of selected target quantities, and conversion thereof into representative electrical signals. Said sensing electronics comprisean electrode and a connection element for connecting the electrode to a control circuitry, and said film layer (102B) on a second side of the plastic layer comprising features (105, 118, 120, 124, 126, 128, 306, 408, 512, 606C, 608C, 710, 810, 1002) including one conductive feature, said features being configured to adapt the sensing response of the sensing electronics on the first side of the plastic layer.

Description

technical field [0001] The present invention generally relates to electronic devices, associated devices, structures and methods of manufacture. In particular, though not exclusively, the invention relates to the fabrication of multilayer structures incorporating a number of features for sensing or other purposes. Background technique [0002] In the context of electronic devices and electronics, a variety of different stacked assemblies and structures exist. [0003] The motivations behind the integration of electronic devices and related products can be as varied as the associated usage contexts. When the resulting solution finally exhibits a multi-layered nature, size savings, weight savings, cost savings, or simply efficient integration of components with associated, potentially synergistic functions may be initially sought. In turn, associated usage scenarios may relate to product packaging or food packaging, visual design of device housings, wearable electronics, per...

AI Technical Summary

Problems solved by technology

[0015] Still further, on some occasions, it has been found to be tricky to include several conductive layers and for example current connection layers or general features in a common structure, because the relevant features themselves or the required connection elements are difficult to accurately position and align, and there are many The quality of connections (e.g. electrical connections) obtained between layers may still be suboptimal to some extent

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