Ceramic tile cutting device

Abstract

The invention relates to a ceramic tile cutting device which comprises a base, a cutting table arranged above the base, a buffer mechanism for supporting the cutting table, slide bars symmetrically arranged on the cutting table correspondingly, a supporting plate connected to the top end of the slide bars, a cutting knife arranged below the supporting plate and an adjusting part slidably connectedto the supporting plate for adjusting the position of the cutting knife. A fixed slot is formed in the cutting table, a plurality of buffer regions and cutting regions are arranged in a spaced mannerat the bottom of the fixed slot, and buffer mechanisms are arranged in positions corresponding to the buffer regions at the bottom of the cutting table. As the buffer mechanisms are arranged in a position corresponding to the buffer regions at the bottom of the cutting table, when the cutting knife cuts a ceramic tile and enters into the cutting regions, vibration generated is buffered by the buffer mechanisms on two sides of the cutting region and excessive vibration generated in a cut position of the ceramic tile is avoided, so that flatness of a glaze in the cut position of the ceramic tile is ensured.

Description

technical field [0001] The invention relates to the technical field of tile processing equipment, in particular to a tile cutting device. Background technique [0002] When decorating the interior, laying tiles has become a common phenomenon. In the process of laying tiles, it is necessary to cut the tiles differently according to the different indoor conditions. The traditional situation is that the operator puts the tiles on the workbench. , and then use your feet to press one end of the tile, and use a cutting knife to cut the other end at the same time, the fixation is unstable, resulting in poor cutting effect, inaccurate size and other problems. Inefficient and dangerous. When the existing tile cutting device cuts the tiles, it is easy to cause the glazed surface of the tile cutting part to be uneven, thereby causing waste of materials. Contents of the invention [0003] The object of the present invention is to provide a tile cutting device which solves the proble...

AI Technical Summary

Problems solved by technology

[0002] When decorating the interior, laying tiles has become a common phenomenon. In the process of laying tiles, it is necessary to cut the tiles differently according to the different indoor conditions. The traditional situation is that the operator puts the tiles on the workbench. , and then use your feet to press one end of the tile, and use a cutting knife to cut the other end at the same time, the fixation is unstable, resulting in poor cutting effect, inaccurate size and other problems. inefficient and dangerous

When the existing ceramic tile cutting device cuts the tiles, it is easy to cause the glaze surface of the tile cutting place to be uneven, resulting in waste of materials

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